Patents by Inventor John B. Brinkerhoff

John B. Brinkerhoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit assembly having component locating features
    Patent number: 5528461
    Abstract: A printed circuit assembly (5) has a surface mount electronic component (14), circuit board (10), and locating features to align (16) the surface mount electronic component on the printed circuit board. The locating features may comprise solder bumps (24) on the printed circuit board. The locating features are arranged on the surface of the printed circuit board to lie proximal to the main body (22) of the surface mount electronic component. The locating features prevent movement of the surface mount electronic component prior to soldering the surface mount electronic component to the printed circuit board.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: June 18, 1996
    Assignee: Motorola, Inc.
    Inventors: Kiron Gore, Edward J. Hall, John B. Brinkerhoff