Patents by Inventor John B. Coniff

John B. Coniff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of heat sinking and mounting a solid-state device
    Patent number: 5363552
    Abstract: A unitary strip of thermally and electrically conductive spring material is formed with two rows of spring fingers formed at one end which have frictionally engaged therebetween the bus bar or plate of a solid-state device such as an FET having leads soldered to a printed circuit board. The opposite end of the strip is fastened mechanically to a conductive heat sink block on the circuit board. The strip provides electrical power, support for, and heat sinking of the solid-state device.
    Type: Grant
    Filed: July 23, 1993
    Date of Patent: November 15, 1994
    Assignee: Eaton Corporation
    Inventor: John B. Coniff
  • Method of forming electrical contact/terminal
    Patent number: 5175927
    Abstract: A flat strip of conductive material is formed by extrusion with an integrally formed thickened or flanged portion along at least one longitudinal edge of the extrusion. Individual contact/connector terminals are then stamped from the extrusions with the flat portions forming the blade of the connector terminal and the thickened flanged portion forming a head on the blade which provides the integrally formed contact surface.
    Type: Grant
    Filed: October 2, 1991
    Date of Patent: January 5, 1993
    Assignee: Eaton Corporation
    Inventor: John B. Coniff