Patents by Inventor John B. Dion

John B. Dion has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Post fabrication processing of semiconductor chips
    Patent number: 5277756
    Abstract: A method for for processing semiconductor chips which deters the formation of "tin whiskers" and which removes excess substrate material from the passive side of a semiconductor device is presented. The deterrence of tin whiskers is accomplished by controlling the size of the bead of flowable metal on the conductive bump. The removal of excess material from the passive side of the semiconductor device is accomplished by chemical reaction after the formation of the conductive bump.
    Type: Grant
    Filed: June 15, 1992
    Date of Patent: January 11, 1994
    Assignee: Digital Equipment Corporation
    Inventor: John B. Dion
  • Post fabrication processing of semiconductor chips
    Patent number: 5130275
    Abstract: A method for processing semiconductor chips which deters the formation of "tin whiskers" and which removes excess substrate material from the passive side of a semiconductor device is presented. The deterrence of tin whiskers is accomplished by controlling the size of the bead of flowable metal on the conductive bump. The removal of excess material from the passive side of the semiconductor device is accomplished by chemical reaction after the formation of the conductive bump.
    Type: Grant
    Filed: July 2, 1990
    Date of Patent: July 14, 1992
    Assignee: Digital Equipment Corp.
    Inventor: John B. Dion