Abstract: A multi-wire slurry-free wafer cutting apparatus along with a method for optimizing saw operation is disclosed that includes a cutting wire impregnated with a plurality of cutting particles wrapped multiple times around two or more wire guides to form a multi-wire web. A drive mechanism drives the web across an ingot at an optimum speed determined by setting a multi-wire web speed to an initial speed, detecting vibration of the web, identifying the web speed having a lowest vibration, and operating the drive mechanism at that speed as optimum. A cleansing fluid is applied to the multi-wire web that includes a major portion of water and a minor portion of surfactant which cleans the cutting wire and keeps the cut particles free of oxidation. One or more cleansing fluid applicators are configured to apply the cleansing fluid to the multi-wire web close to the ingot in a laminar flow.

Abstract: A closed loop wire saw loop, a method for making the closed wire saw loop, and an apparatus and method for slicing a work piece, in particular, a polysilicon or single crystal silicon ingot, utilizing a closed loop of diamond impregnated wire in which the work piece (or ingot) is rotated about its longitudinal axis as the diamond wire is driven orthogonally to it and advanced from a position adjoining the outer diameter (“OD”) of the ingot towards its inner diameter (“ID”). In this manner, the diamond wire cuts through the work piece at a substantially tangential point to the circumference of the cut instead of through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal ‘kerf” loss and less extensive follow-on lapping operations. The closed wire saw loop is made by squaring and welding the wire ends together and then twice heat treating the weld at about 1500 F.

Abstract: An apparatus for cutting a substantially cylindrical work piece in a direction generally perpendicular to a longitudinal axis of the work piece includes a wire having a plurality of cutting elements affixed thereto and a wire drive mechanism for driving the wire across and through the work piece. The wire drive mechanism includes a capstan to move the wire orthogonally across a longitudinal axis of the work piece, a rotational drive to oscillate the wire around the longitudinal axis and an advancing drive to advance the wire perpendicularly through the longitudinal axis of the work piece. In a particular embodiment disclosed herein, the apparatus comprises imparts a substantially rocking motion to the wire drive mechanism about the longitudinal axis of the work piece and the cutting elements of the wire are impregnated diamonds.

Abstract: A closed loop wire saw loop, a method for making the closed wire saw loop, and an apparatus and method for slicing a work piece, in particular, a polysilicon or single crystal silicon ingot, utilizing a closed loop of diamond impregnated wire in which the work piece (or ingot) is rotated about its longitudinal axis as the diamond wire is driven orthogonally to it and advanced from a position adjoining the outer diameter ("OD") of the ingot towards its inner diameter ("ID"). In this manner, the diamond wire cuts through the work piece at a substantially tangential point to the circumference of the cut instead of through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal `kerf` loss and less extensive follow-on lapping operations. The closed wire saw loop is made by squaring and welding the wire ends together and then twice heat treating the weld at about 1500 F.

Abstract: An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire saw in which either the workpiece (or ingot) is rotated, either continuously or reciprocally, about its longitudinal axis or the diamond wire saw is rotated, either reciprocally or continuously, about the longitudinal axis of the workpiece as the diamond wire is driven orthogonally to the longitudinal axis of the workpiece. When the relative rotation is continuous, the wire is advanced from a position tangentially adjoining the outer diameter ("OD") of the ingot to a position tangential to its center or inner diameter ("ID"). When the rotation is reciprocating, the wire is advanced from a position tangentially adjoining the outer diameter to a position through the workpiece.

Abstract: An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire saw in which either the workpiece (or ingot) is rotated about its longitudinal axis or the diamond wire saw is rotated about the longitudinal axis of the workpiece as the diamond wire is driven orthogonally to the longitudinal axis of the workpiece and advanced from a position tangentially adjoining the outer diameter ("OD") of the ingot to a position tangential to its center or inner diameter ("ID"). In this manner, the diamond wire cuts through the workpiece at a substantially tangential point to the circumference of the cut instead of straight through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal `kerf" loss and less extensive follow-on lapping operations.

Abstract: An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire in which the workpiece (or ingot) is rotated about its longitudinal axis as the diamond wire is driven orthogonally to it and advanced from a position adjoining the outer diameter ("OD") of the ingot towards its inner diameter ("ID"). In this manner, the diamond wire cuts through the workpiece at a substantially tangential point to the circumference of the cut instead of through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal `kerf" loss and less extensive follow-on lapping operations.

Abstract: An apparatus for storage of computer media has side stands supporting adjustable shelves to accommodate computer media of varying heights, widths and depths. Brackets supporting the shelves engage with holes formed in the side stands to releasably secure the shelves over a range of heights. The shelves are L-shaped and are open on top. The shelves may have dividing tabs to facilitate the storing and dispensing of computer media and the spacing between the tabs may be varied to accommodate computer media of varying widths. A lid and a bottom are secured to the side stands to increase the apparatus' overall structural strength and rigidity. A reinforcing member extends across the bottom between the side stands to ensure that the side stands remain parallel to each other and perpendicular to the lid and bottom.

Abstract: A rinsing system for steel strip after acid pickling comprises a plurality of consecutive adjacent rinse compartments, each of which contains a bath of rinse solution which is sprayed onto the strip as it passes through the compartment. Fresh water is added to the last compartment and a volume of solution equivalent to the added fresh water is continuously transferred from each compartment to an adjacent compartment. A concentrated waste rinse effluent is removed from the first compartment.