Abstract: A desoldering device is disclosed having a solder transferring tube in communication with a solder collection chamber and a pivotal handle attached to the solder collection chamber so that the handle may assume within a plane different angular positions with respect to the solder transfer tube without affecting proper orientation of the tubular front portion with respect to a workpiece. Moreover, a switch for controlling the vacuum is disposed on the handle and the handle is rotatable about its own axis so that the vacuum switch may have various orientations with respect to the plane in which the handle may assume different angular positions.

Abstract: A machine for setting eyelets and the like in printed circuit boards includes a generally U-shaped frame having a pair of spaced-apart support arms defining a workpiece receiving zone therebetween, a first tool movably mounted in one of the support arms, and a second tool fixedly mounted in the other support arm and axially aligned with the first tool. An adjustable torque screw is connected to the first tool for moving the first tool into aligned contact with the second tool at a pre-determined eyelet setting pressure. The adjustable torque screw insures that the eyelet setting pressure does not exceed the pre-determined eyelet setting pressure despite continued rotation of the adjustable torque screw.

Abstract: The invention is a device for attaching or removing electronic components from a substrate and includes a nozzle for delivering heat to the terminal areas of the substrate. The nozzle includes a first plate, spaced from the component, having openings corresponding to the terminals of the component. The nozzle further includes a second portion below the plate for directing heated fluid to the component. Further, at least one opening in the plate is enlarged to delivery more heat to certain terminals connected to a ground plate, for example.