Patents by Inventor John B. Hubbard

John B. Hubbard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149551
    Abstract: A construction board comprising (i) a foam layer; (ii) a facer substrate; and (iii) a fire-resistant interfacial layer disposed between said facer substrate and said foam layer.
    Type: Application
    Filed: January 15, 2024
    Publication date: May 9, 2024
    Inventors: Chunhua YAO, Michael J. HUBBARD, John B. LETTS
  • Patent number: 11913222
    Abstract: A construction board includes a foam body having first and second planar surfaces, said foam body including a polyisocyanurate foam matrix defining a plurality of closed cells, said closed cells being at least substantially devoid of hydrocarbon blowing agents, and said foam body being characterized by a density, pursuant to ASTM C303, of at least 2.5 lbs/ft3; and a facer disposed on a planar surface of said foam body, said facer including a glass substrate having an internal planar surface proximate to said foam body and an external planar surface opposite said foam body, a first coating disposed on said external surface, and a second coating disposed on or proximate to said internal surface, where said first coating disposed on said external surface includes an inert filler, and where said second coating disposed on or proximate to said internal surface includes intumescent material.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: February 27, 2024
    Assignee: Holcim Technology Ltd
    Inventors: John B. Letts, Chunhua Yao, Michael J. Hubbard
  • Patent number: 4866841
    Abstract: An integrated circuit chip carrier with pin grid array is provided with at least two layers of plastics material on the upper of which is provided a central chip location area and a series of metallized areas provided by printed circuit board methods to a series of metallized holes disposed inwardly of the edges of the carrier, a wall of plastics material being disposed round the edges of said upper layer to form a central cavity, the lower layer of plastics material bonded to said upper layer having a series of openings for a pin grid array and an intermediate metallized printed circuit layer disposed between said upper and lower layers to provide electrical conductive paths from the metallized holes to the openings and pins extending downwardly from said lower layer with heads mounted in said openings said array of pins being capable of being across the entire under surface of the carrier. The structure provides superior arrays of pins and similar techniques for construction.
    Type: Grant
    Filed: September 15, 1988
    Date of Patent: September 19, 1989
    Assignee: Advanced Semiconductor Packages Ltd.
    Inventor: John B. Hubbard