Abstract: Projecting leads (28) on a support container (16) for a mini-oscillator assembly (14) initially are straightened in perpendicular directions in a lead-straightening mechanism (48). The straightened leads (28) then are reverse-bent in a bending mechanism (50), utilizing contact pads (26) on a substrate (22) of the mini-oscillator assembly (14) as anvils, so that the lead outer end portions retain the assembly adjacent the support container and so that the lead outer end portions can be bonded to the contact pads. Seating of the lead outer end portions (59) firmly on the contact pads (26) is insured by a lead-seating mechanism 60. The lead-bending mechanism 50 also applies pressure to the substrate (22) in the lead-bending operation to cause uniform spreading of an adhesive material (33) between the substrate and the support container (26).

Abstract: A mini-oscillator assembly (20) is formed by initially bonding ribbon leads (34) to contact pads (32) on a planar substrate (26) of a hybrid integrated circuit device (22) such that the leads project from the substrate in the plane thereof. Inverted V-shaped notches (50) then are formed in the ribbon leads (34) as the leads are cut to length. The ribbon leads (34) then are formed over the substrate (26) so that the V-shaped notches (50) face away from the substrate (26) and are aligned with one another on opposite sides of a plane extending from an imaginary line (52) extending between and interconnecting the substrate contact pads (32). Wire leads (38) of a crystal resonator plate (24) then are soldered in the V-shaped notches (50) to form the mini-oscillator assembly (20).