Patents by Inventor John B. Rausch

John B. Rausch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7942997
    Abstract: A method of manufacturing a printhead for an inkjet print cartridge includes depositing a metal film on a mandrel; separating the metal film from the mandrel, mounting the metal film to a work holder, modifying the metal film while the metal film remains mounted on the work holder, laminating the metal film to a barrier material and semiconductor substrate to form a printhead, and applying heat to the printhead such that the printhead barrier layer is cured and the metal film is bonded thereto. Laminating the metal film to the barrier material includes preheating the barrier material and placing the metal film on the preheated barrier material.
    Type: Grant
    Filed: April 8, 2008
    Date of Patent: May 17, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Rio Rivas, Lawrence H. White, Ed Friesen, John B. Rausch
  • Publication number: 20090250162
    Abstract: A high-resolution printer includes a printhead having optimized features including 3 to 20 micron diameter orifices spaced apart from adjacent orifices by a distance of between about 15 and 75 microns. The orifice plate is electroformed and plated to a thickness ranging from about 6 to 19 microns. A barrier layer secures the orifice plate to a printhead substrate.
    Type: Application
    Filed: April 8, 2008
    Publication date: October 8, 2009
    Inventors: Rio Rivas, Lawrence H. White, Ed Friesen, John B. Rausch
  • Patent number: 7377618
    Abstract: A high-resolution printer includes a printhead having optimized features including 3 to 20 micron diameter orifices spaced apart from adjacent orifices by a distance of between about 15 and 75 microns. The orifice plate is electroformed and plated to a thickness ranging from about 6 to 19 microns. A barrier layer secures the orifice plate to a printhead substrate.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: May 27, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Rio Rivas, Lawrence H. White, Ed Friesen, John B. Rausch
  • Patent number: 6832434
    Abstract: Methods of forming thermal ink jet resistor structures for use in nucleating ink are described. In one embodiment, the method comprises forming a layer of conductive material over a substrate, and patterning and etching the layer of conductive material effective to form one or more arrays of resistors. Individual arrays comprise multiple, parallel-connected resistor elements and the resistor elements are configured such that failure of any one resistor element will not render its associated resistor array inoperative for nucleating ink. The resistor elements of individual arrays are formed such that collectively, the resistor elements are not independently addressable. Other embodiments are described.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: December 21, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John B. Rausch, David A. Shade
  • Patent number: 6648443
    Abstract: A thermal inkjet print head includes a temperature regulation system. The print head preferably includes a thermal inkjet print head and an array or array of Peltier devices in proximity to the thermal inkjet print head such that the array of Peltier devices can raise or lower the temperature of the thermal inkjet print head or components thereof.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: November 18, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John B. Rausch, David A. Shade
  • Publication number: 20030132989
    Abstract: Methods of forming thermal ink jet resistor structures for use in nucleating ink are described. In one embodiment, the method comprises forming a layer of conductive material over a substrate, and patterning and etching the layer of conductive material effective to form one or more arrays of resistors. Individual arrays comprise multiple, parallel-connected resistor elements and the resistor elements are configured such that failure of any one resistor element will not render its associated resistor array inoperative for nucleating ink. The resistor elements of individual arrays are formed such that collectively, the resistor elements are not independently addressable. Other embodiments are described.
    Type: Application
    Filed: January 3, 2003
    Publication date: July 17, 2003
    Inventors: John B. Rausch, David A. Shade
  • Publication number: 20030095165
    Abstract: A process of manufacturing a printhead of a print bar by applying, on the same side of a glass substrate, a fluid firing device, a fluid reservoir supplying fluid to the fluid firing device, and drive electronics supplying power and signals to the fluid firing device. The fluid firing device has a firing chamber, a heating element beneath the firing chamber, a fluid ejection orifice, and a fluid channel directing fluid from the fluid reservoir to the heating element to be ejected through the orifice.
    Type: Application
    Filed: January 3, 2003
    Publication date: May 22, 2003
    Inventors: Paul H. McClelland, John B. Rausch
  • Patent number: 6527378
    Abstract: Thermal ink jet defect tolerant resistor designs are described. In one embodiment, a thermal ink jet resistor structure comprises a first resistor element and at least one other resistor element. The resistor elements are connected in parallel and have substantially the same resistances. The resistor elements are configured for redundancy such that if one of the resistor elements fails, one or more remaining resistor elements can function to effectuate ink ejection. In another embodiment, a thermal ink jet printer comprises multiple ink reservoirs configured for holding and ejecting ink toward a print medium. At least one resistor array is disposed within each ink reservoir. Each resistor array comprises multiple, redundant resistor elements that are connected in parallel with one another such that failure of any one resistor element will not render its associated ink reservoir inoperative.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: March 4, 2003
    Assignee: Hewlett-Packard Company
    Inventors: John B. Rausch, David A. Shade
  • Patent number: 6520628
    Abstract: A process of manufacturing a printhead of a print bar by applying, on the same side of a glass substrate, a fluid firing device, a fluid reservoir supplying fluid to the fluid firing device, and drive electronics supplying power and signals to the fluid firing device. The fluid firing device has a firing chamber, a heating element beneath the firing chamber, a fluid ejection orifice, and a fluid channel directing fluid from the fluid reservoir to the heating element to be ejected through the orifice. The fluid firing device has thin film layers. The thin film layers include a conductor layer that forms conductor traces that couple with the drive electronics. The thin film layers also include a cross-linked photoimagable polymer layer that forms the fluid channel, the firing ejection nozzle, and the firing chamber. In one embodiment, the firing chamber and the fluid ejection orifice are positioned over the heating element.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: February 18, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Paul H McClelland, John B Rausch
  • Publication number: 20020154196
    Abstract: Thermal ink jet defect tolerant resistor designs are described. In one embodiment, a thermal ink jet resistor structure comprises a first resistor element and at least one other resistor element. The resistor elements are connected in parallel and have substantially the same resistances. The resistor elements are configured for redundancy such that if one of the resistor elements fails, one or more remaining resistor elements can function to effectuate ink ejection. In another embodiment, a thermal ink jet printer comprises multiple ink reservoirs configured for holding and ejecting ink toward a print medium. At least one resistor array is disposed within each ink reservoir. Each resistor array comprises multiple, redundant resistor elements that are connected in parallel with one another such that failure of any one resistor element will not render its associated ink reservoir inoperative.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 24, 2002
    Inventors: John B. Rausch, David A. Shade
  • Publication number: 20020101481
    Abstract: A process of manufacturing a printhead of a print bar by applying, on the same side of a glass substrate, a fluid firing device, a fluid reservoir supplying fluid to the fluid firing device, and drive electronics supplying power and signals to the fluid firing device. The fluid firing device has a firing chamber, a heating element beneath the firing chamber, a fluid ejection orifice, and a fluid channel directing fluid from the fluid reservoir to the heating element to be ejected through the orifice.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Inventors: Paul H. McClelland, John B. Rausch
  • Patent number: 6341848
    Abstract: A printhead is used to eject printing fluid, such as ink, onto a printing medium. This printhead has an integrated heat-sink used to cool energy dissipation elements which propel the printing fluid from the printhead. The printhead includes an amorphous substrate carrying a structure of plural thin-film layers. Upon the substrate is defined a metallic heat sink layer covering substantially the entire plan-view shape of the substrate, and serving during operation of the printhead to distribute excess heat for dissipation. During manufacturing of the printhead, this thin-film metallic heat sink layer performs the additional function of preventing an element or compound present in the substrate from migrating into the thin-film layers.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: January 29, 2002
    Assignee: Hewlett-Packard Company
    Inventors: David A. Shade, John B. Rausch