Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract: Methods and apparatus for providing an integrated circuit package device, comprising a conductive leadframe, a magnetic sensor element disposed on the leadframe, wherein the leadframe includes a slot configuration to reduce eddy current flow about the magnetic sensor, the slot configuration including a first slot generally perpendicular to a second slot, wherein the first slot extends under the sensor element.

Abstract: A semiconductor structure having: semiconductor devices formed in an inner region of a semiconductor chip; a seal ring formed in the chip and disposed about the inner region; and, a plurality of trenches formed along a surface of the chip. The trenches are disposed in a corner region of the chip. A portion of the seal ring is disposed between the trenches and the inner region of the chip. The trenches are disposed along axes oblique to outer edges of the chip. A method is provided for encapsulating a semiconductor chip. The method includes the steps of: providing a semiconductor chip having active semiconductor devices in an inner region of the semiconductor chip and a seal ring in the chip about the inner region; and, forming a plurality of trenches in the chip, a portion of the seal ring being formed between the trenches and the inner region of the chip. A cover is formed having bottom portions in the trenches and on the passivation layer.