Abstract: An encapsulated microelectronic device (100) including a base (101) and a semiconductor device (305) having a top and a bottom. The bottom is attached to the base (101). The semiconductor device (105) has a thickness in the range from one-fourth to three-fourths of a millimeter and has a bottom metallization consisting of aluminum (407)/chromium (405)/nickel (403)/gold (401). The semiconductor device (305) has a contact (115) attached to the top. The encapsulated microelectronic device (100) has a molded top (120) surrounding the semiconductor device (305). The molded top (120) is made from low stress molding material.

Abstract: A semiconductor package is provided having a die attach flag (12) with integral flanges (13) which prevent high pressure plastic encapsulant (18) from escaping or entering between the die attach flag (12) and a mold cavity plate (15) during encapsulation. The die attach flag (12) is held flush against the cavity plate (15) by the packing pressure of the encapsulant (18) during low pressure stages of the encapsulation process. Plastic flowing along the flange (13) solidifies more rapidly than plastic in the body of the semiconductor package, thereby damming plastic flow at the edges of the die attach flag (12) during high pressure stages of the encapsulation process.

Abstract: A molding apparatus for encapsulating devices and having at least one molding pot wherein the pot has a configured bottom is used. The configured bottom serves as a shearing force against encapuslating material pellets which are pressed into the configured bottom by a plunger. The shearing force increases the fluidizing action of the pellets thereby lowering the viscosity of the encapsulating material so it easily enters cavities provided in the molding assembly and completely fills the cavities and encapsulates the devices without damage to the devices.

Abstract: A molding apparatus for encapsulating devices and having a molding pot wherein the pot has a configured bottom is provided. The configured bottom serves as a shearing force against encapsulating material pellets which are pressed into the configured bottom by a plunger. The shearing force increases the fluidizing action of the pellets thereby lowering the viscosity of the encapsulating material so it easily enters cavities provided in the molding assembly and completely fills the cavities and encapsulates the devices without damage to the devices.

Abstract: An elastic material covering an outer surface of a cavity plate but not covering any clamping surfaces of the cavity plate or the inner surface of the cavity plate is used to eliminate use of a dam bar in a lead frame. In an embodiment in accordance with the present invention the elastic material provides a supplementary seal to the clamping surfaces of the cavity plate and a primary seal in spaces between leads of the encapsulated lead frame. In a method of using the present invention, the elastic material is placed between the mold base and the cavity plate. A semiconductor lead frame to be encapsulated is placed in cavities provided by the cavity plate. The mold is closed so that clamping surfaces of the cavity plate clamp directly onto the leads. The elastic material deforms under pressure to compensate for any dimensional variations of the mold plates or lead frame and completely seals the space between leads.

Abstract: A self-propelled continuous mining machine which includes a mobile frame assembly having a material dislodging device, and a conveying system. A dust collecting system is positioned on the mobile frame assembly for inducing a flow of air through a duct system. As material is dislodged from a mine face, the dust collecting system draws airborne dust created by the dislodging device through the duct system and into the collecting system mounted on the mobile frame assembly. The duct system has two sets of vertical walls each connected to and spaced by a horizontal wall with one set of vertical walls fitting channel-like into the other set of vertical walls. The duct assembly has a gasket, seal or other means of preventing airborne dust from escaping through the two sets of vertical walls. The duct assembly is expandable to increase the capacity of the duct system.

Abstract: A resilient sheet of material is used between a cavity plate and a mold base in a sytem used to encapsulate items such as semiconductor devices. The resilient sheet of material compensates for any dimensional variations in the cavity plates. In addition, compensation is also made for dimensional variations of the item being encapsulated. In one embodiment, the sheet of resilient material is used to seal cavity openings in the cavity plate. A method for the use of such an arrangement is also provided.

Abstract: A mold handling aid is provided to assist in moving of a heavy mold on a platen of a mold press. Rollers are placed on the mold itself and engage the platen until the mold reaches its final mounting position on the platen. At this time an air bearing is used to precisely position the mold. In this manner the rollers do not bear any load once a mold is in its final position on the platen.

Abstract: An improved molding process utilizes a thixotropic compound. The thixotropic compound is transferred from a feed pot to a manifold having at least one outlet. The manifold is held at a temperature in which the thixotropic compound is not cured. The manifold is engaged with a mold that has an inlet opening that runs to a mold cavity, such that the outlet of the manifold and the inlet of the mold communicate with each other. The thixotropic compound is transferred from the manifold into the mold cavity, which is held at a temperature at which the thixotropic compound is cured. The manifold and the mold are then separated, drawing the thixotropic compound near the exit of the feed runners into the manifold, thus making a clean separation.

Abstract: A semiconductor package having an internally isolated die flag form an externally exposed heatsink is provided by using a two stage molding process. The first molding stage provides a uniform layer of molding material of a predetermined thickness between a die flag area and a heatsink area. A second stage molding procedure then provides the packaging encapsulation thereby establishing the outer dimensions.

Abstract: A mold press comprising a force equalizer independent of the mold platens. The force equalizer consists of a pair of plates defining a cavity therebetween. The cavity is filled with a force distributing material, such as hydraulic fluid. An opening is provided through the force equalizer to provide the extruder access to the mold plates. This opening is surrounded by a floating seal which permits movement of the equalizer plates with respect to the seal. The cavity is designed to extend beyond the chase footprint areas by an amount dictated by the size and relation of the footprint areas to one another.

Abstract: The formation of flash during plastic encapsulation of electronic devices may be reduced or eliminated and the mold made substantially self-cleaning by modifying the mold chases so that the edges of the channels, runners, gates, and/or other locations containing plastic have a wedge shaped edge region extending to the parting plane of the mold. The wedge angle is desirably in the range 15-30 degrees, measured with respect to the parting plane. The length of the wedge should be sufficient to provide for heating of the thermosetting plastic flowing therein, with about 0.05 inches (1.3 mm) being useful for typical dual-in-line, surface mount, flat pack, or other types of semiconductor device and integrated circuit package molds. The plastic flowing into the wedges shaped region solidifies more rapidly than the plastic in the main channel, thereby damming the wedge to prevent flash formation at the mold parting line at the edges of the plastic containing regions.

Abstract: Injection or transfer molding of plastic is performed in a manner that virtually eliminates flash. Deflection of the mold press is measured with the mold press in a clamping configuration. Then the support structure of the molds is arranged to apply an equal force to the mold face by configuring supporting pillars and bars such that they act as individual springs. Their spring constants and/or lengths are calculated to account for the actual deflection found in the mold press, thereby, producing a uniform pressure on the molds during clamping of the press.

Abstract: Sterile pharmaceutical compositions for parenteral administration containing the compound 2,6-diisopropylphenol, and a method for producing anaesthesia in a warm-blooded animal by parenteral administration of said compound.