Abstract: This invention concerns the use of nanoparticles comprising an analyte in the preparation of a calibration standard for use in an analytical atomic spectroscopic technique and a method of calibrating such an instrument.

Abstract: This invention concerns the use of nanoparticles comprising an analyte in the preparation of a calibration standard for use in an analytical atomic spectroscopic technique and a method of calibrating such an instrument.

Abstract: A self-contained training device for simulated personnel entry, exit and rescue in confined space scenarios. The device features an enclosed tank mounted on a truck trailer. The tank has at least one top portal and at least one side portal for entry and exit. An enclosed pipe is situated within the tank and has separate points of entry and exit. The top of the tank features a walkway and handrail.

Abstract: A differential pair (200) is provided by routing a printed circuit board (202) having high density interconnect (HDI) substrate (204) with first and second metal layers (212, 218) such that a first runner (206) forms a zigzag pattern using the two metal layers while a second runner (208) forms a second zigzag pattern on the same two metal layers. The first and second zigzag patterns overlap so as to provide orthogonal signal flow.

Abstract: Under the present invention, user interface pages are served to a user so that the user can access “information” files in real-time using a web browser or the like. In a typical embodiment, the user will input login data, which will be used to access his/her access control permissions. Based on the access control permissions, the files the user is authorized to access will be displayed in a list along with a list of links to other computer systems in the network the user can access. When the user selects a desired file, that file will be retrieved in real-time and the information therein will be communicated to the user for viewing in the interface pages.

Abstract: A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.