Abstract: Compositions are provided comprising aqueous dispersions of polythienothiophenes and colloid-forming polymeric acids. Films from invention compositions are useful as hole injection layers in organic electronic devices, including electroluminescent devices, such as, for example, organic light emitting diodes (OLED) displays, as hole extraction layers in organic optoelectronic devices, such as organic photovoltaic devices, and in combination with metal nanowires or carbon nanotubes in applications such as drain, source, or gate electrodes in thin film field effect transistor.

Abstract: A process for removing organic electroluminescent residues from a substrate is described herein. The process includes the steps of providing a process gas comprising a fluorine-containing gas, optionally an oxygen-containing gas, and optionally an additive gas; activating the process gas in a remote chamber using at least one energy source to provide reactive species; and contacting the surface of the substrate with the reactive species to volatilize and remove the organic electroluminescent residue from the surface.

Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.

Abstract: A multilayer packaging material comprising (a) at least one layer of a gas-permeable material, and (b) at least one layer of a gas-barrier coating comprising a polymeric polyol made by copolymerizing a multifunctional epoxide resin and water in the presence of an amount of acid effective for polymerizing the epoxide resin and the water, the amount of water being sufficient to avoid gelation, the polymeric polyol optionally reacted with a crosslinking agent for hydroxyl functionality, especially an amino resin.

Abstract: A multilayer packaging material comprising

Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.