Abstract: A partially flexible circuit board and a method of manufacturing the same. The partially flexible circuit board of the present invention comprises: laminated alternating layers of prepreg and conductive printed circuitry with apertures in one or more of the prepreg layers in those areas that are required to undergo limited flexing. Fabrication is accomplished by removal of the prepreg in the aperture area of at least one of the prepreg layers; filling of the aperture with a suitable heat resistant and non-adhesive filler prior to lamination; laminating additional prepreg and conductive printed circuit layers prepared for revealing the aperture, subsequent to lamination; cutting slots at the edges of the circuit board that communicate with the apertures to permit flexing across the width thereof without interference with the encompassed circuitry; and removing the filler and any residual prepreg from the aperture to leave the aperture in the prepreg and conductive foil at the desired locations(s).