Patents by Inventor John Benham

John Benham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090085697
    Abstract: In at least one embodiment an apparatus is provided that includes an electromagnetic coupler to provide sampled electromagnetic signals and an electronics component to receive the sampled electromagnetic signals from the electromagnetic coupler, to amplify and recover a derivative-like output signal, and to provide recovered sampled electromagnetic signals to an oscilloscope with a unity transfer function. Other embodiments may be described and claimed.
    Type: Application
    Filed: September 27, 2007
    Publication date: April 2, 2009
    Inventors: Todd Hinck, Larry Tate, John Benham, John Critchlow
  • Publication number: 20070287325
    Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.
    Type: Application
    Filed: June 29, 2007
    Publication date: December 13, 2007
    Applicant: INTEL CORPORATION
    Inventors: Thomas Simon, Rajeevan Amirtharajah, John Benham, John Critchlow
  • Publication number: 20070173100
    Abstract: The present invention, in one aspect, provides a connector apparatus that can be used in, among other things, applications requiring RF or high-speed digital electrical signals.
    Type: Application
    Filed: February 26, 2007
    Publication date: July 26, 2007
    Applicant: Winchester Electronics Corporation
    Inventor: John Benham
  • Publication number: 20070153490
    Abstract: An article of manufacture includes a substrate and a first electrical conductor supported on the substrate. The first electrical conductor is to carry a signal from an integrated circuit package. In addition, the article of manufacture includes a second electrical conductor supported on the substrate and located to electromagnetically couple to the first electrical conductor. The second electrical conductor is to be coupled to a signal analyzer.
    Type: Application
    Filed: December 30, 2005
    Publication date: July 5, 2007
    Inventor: John Benham
  • Patent number: 7202756
    Abstract: According to some embodiments, a signal line associated with a printed circuit board is provided. In addition, a conductive trace is electrically connected to a portion of the signal line. At least a portion of the conductive trace may be offset from the signal line, and a dielectric layer may be provided between the signal line and the conductive trace to enhance electromagnetic coupling between them. As a result a hybrid resistance and electromagnetic coupling probe may be provided.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: April 10, 2007
    Assignee: Intel Corporation
    Inventors: John Benham, John Critchlow
  • Publication number: 20070035360
    Abstract: In some embodiments, a hybrid coupler is provided with a resistive coupler to conductively tap a transmission line and an electromagnetic coupler to be disposed next to the transmission line to electromagnetically tap it. Other embodiments are disclosed herein.
    Type: Application
    Filed: August 10, 2005
    Publication date: February 15, 2007
    Inventor: John Benham
  • Publication number: 20060290440
    Abstract: According to some embodiments, a signal line associated with a printed circuit board is provided. In addition, a conductive trace is electrically connected to a portion of the signal line. At least a portion of the conductive trace may be offset from the signal line, and a dielectric layer may be provided between the signal line and the conductive trace to enhance electromagnetic coupling between them. As a result a hybrid resistance and electromagnetic coupling probe may be provided.
    Type: Application
    Filed: June 24, 2005
    Publication date: December 28, 2006
    Inventors: John Benham, John Critchlow
  • Publication number: 20060292932
    Abstract: The present invention provides a high-speed electrical interconnection system designed to overcome the drawbacks of conventional interconnection systems. That is, the present invention provides an electrical connector capable of handling high-speed signals effectively.
    Type: Application
    Filed: September 1, 2006
    Publication date: December 28, 2006
    Applicant: Winchester Electronics Corporation
    Inventors: John Benham, Kenny Padro, Robert Godburn
  • Publication number: 20060183375
    Abstract: The present invention, in one aspect, provides a connector apparatus that can be used in, among other things, applications requiring RF or high-speed digital electrical signals.
    Type: Application
    Filed: December 8, 2005
    Publication date: August 17, 2006
    Applicant: Litton Systems, Inc.
    Inventor: John Benham
  • Publication number: 20060118332
    Abstract: The present invention provides a multilayered circuit board that can be used in high-density and high-speed electronic applications.
    Type: Application
    Filed: December 2, 2004
    Publication date: June 8, 2006
    Applicant: Litton Systems, Inc.
    Inventor: John Benham
  • Publication number: 20060082421
    Abstract: A controller sends signals to an electromagnetic coupler associated with a bus. The signals are arranged to set a coupling strength of the coupler.
    Type: Application
    Filed: December 2, 2005
    Publication date: April 20, 2006
    Inventors: Thomas Simon, Rajeevan Amirtharajah, John Benham
  • Publication number: 20060019507
    Abstract: The present invention provides a high-speed electrical interconnection system designed to overcome the drawbacks of conventional interconnection systems. That is, the present invention provides an electrical connector capable of handling high-speed signals effectively.
    Type: Application
    Filed: September 26, 2005
    Publication date: January 26, 2006
    Applicant: Litton Systems, Inc.
    Inventors: John Benham, Kenny Padro, Robert Godburn
  • Patent number: 6929482
    Abstract: An electrical interconnection arrangement includes a cable laminate adapted to receive a plurality of twinaxial cables; an interposer including a plurality of spring contacts; wherein the interposer has a first side adapted to mate with the cable laminate and electrically connect the plurality of spring contacts to one and of the plurality of twinaxial cables; and wherein the interposer has a second side adapted to mate with a PC board and electrically connect the plurality of spring contacts to mating contact points on the PC board.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: August 16, 2005
    Assignee: Litton Systems, Inc.
    Inventor: John Benham
  • Publication number: 20050161254
    Abstract: The present invention provides a multilayered circuit board that can be used in high-density and high-speed electronic applications.
    Type: Application
    Filed: June 28, 2004
    Publication date: July 28, 2005
    Applicant: Litton Systems, Inc.
    Inventors: James Clink, John Benham, John Mitchell
  • Publication number: 20050130458
    Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.
    Type: Application
    Filed: February 3, 2005
    Publication date: June 16, 2005
    Inventors: Thomas Simon, Rajeevan Amirtharajah, John Benham, John Critchlow
  • Publication number: 20050101188
    Abstract: The present invention provides a high-speed connector.
    Type: Application
    Filed: July 19, 2004
    Publication date: May 12, 2005
    Applicant: Litton Systems, Inc.
    Inventors: John Benham, Robert Godburn
  • Publication number: 20050048842
    Abstract: The present invention provides a high-speed electrical interconnection system designed to overcome the drawbacks of conventional interconnection systems. That is, the present invention provides an electrical connector capable of handling high-speed signals effectively.
    Type: Application
    Filed: July 19, 2004
    Publication date: March 3, 2005
    Applicant: Litton Systems, Inc.
    Inventors: John Benham, Kenny Padro, Robert Goodburn
  • Publication number: 20040152359
    Abstract: An electrical interconnection arrangement includes a cable laminate adapted to receive a plurality of twinaxial cables; an interposer including a plurality of spring contacts; wherein the interposer has a first side adapted to mate with the cable laminate and electrically connect the plurality of spring contacts to one and of the plurality of twinaxial cables; and wherein the interposer has a second side adapted to mate with a PC board and electrically connect the plurality of spring contacts to mating contact points on the PC board.
    Type: Application
    Filed: January 21, 2004
    Publication date: August 5, 2004
    Applicant: Litton Systems, Inc.
    Inventor: John Benham