Patents by Inventor John Benjamin Levy

John Benjamin Levy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7669321
    Abstract: A test site is incorporated on a circuit board having a set of test connections passing through a test via on respective test connection layer, the test connection layers including (1) a first layer adjacent to a target layer, and (2) a second layer spaced apart from the target layer with the first layer therebetween. The test via is back-drilled from the direction of the second layer to remove undesired via metallization, breaking the test connections of all the layers through which it passes, and the continuity of the test connections is measured to determine a pattern of broken and non-broken test connections resulting from the back-drilling. The pattern of broken and non-broken test connections is examined to ascertain the actual depth of the back-drilling in relation to the target layer.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: March 2, 2010
    Assignee: Cisco Technology, Inc.
    Inventors: John Benjamin Levy, John Martin, Farhad Pakravan