Abstract: A polyorganosiloxane hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by hydrosilylation reaction.

Abstract: A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.

Abstract: A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by hydrosilylation reaction.

Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by Piers-Rubinsztajn reaction.

Abstract: A polyorganosiloxane hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.

Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.

Abstract: A silicone resin-linear co-polymer is disclosed. The silicone resin-linear copolymer includes a resinous structure having the general formula (1): (R1R2R3SiO1/2)x(R4SiO3/2)y ??(1) wherein each R1, R2, R3 and R4 is an independently selected substituted or unsubstituted hydrocarbyl group, with the proviso that in one molecular at least two of R1, R2, and R3 are aryl groups; and x and y are each from >0 to <1 such that x+y=1; and a linear structure having the general formula (2): (R5R6SiO2/2) ??(2) wherein R5 and R6 are each independently selected substituted or unsubstituted hydrocarbyl groups. End use applications and related methods of the silicone resin-linear copolymer are also disclosed.

Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.

Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.

Abstract: A silicone resin-linear copolymer is disclosed which has a resinous structure (A1) including R1SiO3/2 units, and a linear structure (A2) including repeated R22SiO2/2 units, wherein R1 is a propyl group and each R2 is an independently selected substituted or unsubstituted hydrocarbyl group, and wherein the resinous structure (A1) and the linear structure (A2) are bonded together in the silicone resin-linear copolymer via a siloxane bond.

Abstract: The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C1 to C30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

Abstract: The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C1 to C30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide optically solid compositions which may be considered as “reprocessable”.

Abstract: Resin-linear organosiloxane block copolymers combined with linear or resin organopolysiloxane components are disclosed. In some embodiments, the combination of resin-linear organosiloxane block copolymers with linear or resin organopolysiloxane components provides compositions having improved physical properties, such as improved toughness and flow behavior.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer by reacting a linear organosiloxane and an organosiloxane resin to form a resin-linear organosiloxane block copolymer. The resulting resin-linear organosiloxane block copolymer is then crosslinked to increase the average molecular weight of the resin-linear organosiloxane block copolymer. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide solid, optically clear compositions which may be considered as “reprocessable.

Abstract: Hot melt adhesive compositions are disclosed containing the reaction product of a resin linear organosiloxane block copolymer and an organosilane capping agent containing hydrolyzable groups.