Abstract: A double-sided oscillator package having an open-top oscillator housing adapted to receive electronic components and a hermetically sealed resonator housing containing a piezoelectric element is described. The electronic components and piezoelectric element are electrically connected. The respective housing can be manufactured separately and the components thereof assembled thereafter to form the package.

Abstract: A double-sided oscillator package having an open-top oscillator housing adapted to receive electronic components and a hermetically sealed resonator housing containing a piezoelectric element is described. The electronic components and piezoelectric element are electrically connected. The respective housing can be manufactured separately and the components thereof assembled thereafter to form the package.

Abstract: A crystal support structure and oscillator package for ovenized oscillators that has improved thermal isolation of the crystal. The support has a glass tubular wall with helical coils. Airgaps are formed circumferentially around the wall. A conductive metal layer is located over the surface of the wall. One end of the wall is supporting and electrically connected to a crystal resonator. Another end of the wall is attached to and electrically connected to a substrate. The crystal support forms an electrical path between the crystal resonator and the substrate and thermally isolates the crystal resonator from the substrate.