Patents by Inventor John Birks

John Birks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140318895
    Abstract: A scaffolding system for an attic area has a plurality of board members. An attachment device is sued for securing a first board member to an adjoining board member, wherein the attachment device comprises a pair of removable attachment devices formed on a pair of opposing sides of each board member.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 30, 2014
    Inventor: John Birk
  • Publication number: 20130313046
    Abstract: A scaffolding system for an attic area has a plurality of board members. An attachment device is provided for securing a first board member to an adjoining board member.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 28, 2013
    Inventor: John Birk
  • Publication number: 20060286570
    Abstract: The invention provides methods to detect molecular recognition events. The invention also provides methods to detect the presence of or identify a target species based on its interaction with one or more probe species. The methods of the invention are based on amplification of the signal due to each molecular recognition event. The amplification is achieved through photopolymerization, with the polymer formed being associated with the molecular recognition event. In an embodiment, a fluorescent polymer, a magnetic polymer, a radioactive polymer or an electrically conducting polymer can form the basis of detection and amplification. In another embodiment, a polymer gel swollen with a fluorescent solution, a magnetic solution, a radioactive solution or an electrically conducting solution can form the basis of detection and amplification. In another embodiment, sufficient polymer forms to be detectable by visual inspection.
    Type: Application
    Filed: March 9, 2006
    Publication date: December 21, 2006
    Inventors: Kathy Rowlen, John Birks, Christopher Bowman, Hadley Sikes, Ryan Hansen, Robert Kuchta
  • Publication number: 20060251560
    Abstract: A method and system to consistently and automatically conditioning and delivering a solid-free liquid (filtrate) sample suitable for instrumental analysis is disclosed. A slurry, preferably a slurry produced by a sub-atmospheric pressure chlorate dioxide generating process, is fed through a filter to remove the solid phase and to provide the liquid phase on the downstream side of the filter, where the concentration of at least one dissolved component is determined.
    Type: Application
    Filed: April 13, 2006
    Publication date: November 9, 2006
    Inventors: Mario Costa, John Birks, Chunmin Pu, Kui Xu
  • Patent number: 7014546
    Abstract: A remote powered extendable sander has a sanding unit having a sanding surface. A drive system is coupled to the sanding unit. The drive system is used to move the sanding surface. A drive transfer unit is provided for transferring rotational motion from a small motorized construction tool to the drive system for powering the sanding unit. A housing is coupled to the sanding unit. An extension member is removably coupled to the housing for raising the remote powered extendable sander.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: March 21, 2006
    Inventor: John Birk
  • Patent number: 5034802
    Abstract: A method and structure are provided for aligning SMDs to a substrate. The body of an SMD and that portion of a substrate encircled by the electrical interconnect pads each have a mating physical structure such that the SMD may be quickly placed in the general vicinity of its proper location and the mating physical features cause a precise alignment. In one embodiment, the physical features are nonsymmetrical, thereby preventing accidental placement of the SMD in an undesired rotation. In another embodiment, the physical features vary among device types, thereby ensuring that an improper device is not placed in a particular location on the substrate. In another embodiment, a component carrier is provided which includes depressions for the placement of the SMDs. A vacuum is applied to the carrier which holds each of the SMDs in place. The carrier is then placed in a desired physical relationship with the substrate such that each of the devices held in the carrier is properly aligned with the substrate.
    Type: Grant
    Filed: December 11, 1989
    Date of Patent: July 23, 1991
    Assignee: Hewlett-Packard Company
    Inventors: Sidney Liebes, Jr., John Birk
  • Patent number: 4821157
    Abstract: An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded in then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips.
    Type: Grant
    Filed: August 26, 1987
    Date of Patent: April 11, 1989
    Assignee: Hewlett-Packard Co.
    Inventors: John Birk, Heinz Breu, William Gong, Charles C. Morehouse, Sidney Liebes, Jr.
  • Patent number: 4813255
    Abstract: An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips.
    Type: Grant
    Filed: August 26, 1987
    Date of Patent: March 21, 1989
    Assignee: Hewlett-Packard Company
    Inventors: John Birk, Heinz Breu, William Gong, Charles C. Morehouse, Sidney Liebes, Jr.
  • Patent number: 4705081
    Abstract: An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic compnents so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips.
    Type: Grant
    Filed: February 21, 1986
    Date of Patent: November 10, 1987
    Assignee: Hewlett-Packard Company
    Inventors: John Birk, Heinz Breu, William Gong, Charles C. Morehouse, Sidney Liebes, Jr.