Abstract: A power conditioning circuit includes at least one power storage device having electrodes coupled for receiving power from a DC power source. At least one active current limit (ACL) circuit coupled to the electrodes of the power storage device is for limiting a maximum power output from the power storage device under fault conditions. A DC-to-DC converter has its inputs coupled to the ACL circuit. At least one crowbar circuit has a first terminal and a second terminal and a shorting device coupled to an output of the DC-to-DC converter for providing output terminals for the power conditioning circuit.

Abstract: An interface device for providing Intrinsic Safety to a Smart Identity Module (SIM) card includes a buffer circuit including a voltage regulator and a voltage level translator including drivers. Baseband processor side pins include at least an input/output (IO) pin for receiving data signals, first SIM reset (RST) pin, core power supply (VCC) pin, a clock (CLK) pin, a battery power supply (VBAT) pin, and SIM side pins include at least a VCC pin, a SIM CLK pin, second SIM RST pin, and a SIM IO pin. There is at least one series resistor (R1, R2, R3, R4 and R5) in series with each of the baseband processor side pins.

Abstract: A packaged cellular modem system includes a capacitor for receiving power from a DC power source, a DC-to-DC converter coupled to capacitor electrodes, a cellular modem coupled to the converter output and to an antenna, and an IS barrier circuit coupled to a modem output. A microcontroller coupled to a boost regulator has its output coupled to electrodes. A metrology jumper is between the microcontroller and ground. An encapsulation material provides a potted area for the capacitor, converter, modem, IS barrier circuit and microcontroller. A SIM card is coupled to the modem by the IS barrier circuit. LED's are coupled to the microcontroller. The SIM card and LEDs are in a non-potted area. A transparent SIM card access cover over the SIM card and LEDs enables exposing the SIM card.

Abstract: A system and method for updating industrial cellular communications devices. A supercapacitor and a cellular modem are connected electronically to one another. A host can communicate bidirectionally and wirelessly with the cellular modem. A microcontroller is connected electronically with the cellular modem, such that the microcontroller facilitates monitoring with the cellular modem of a voltage and temperature associated with the super capacitor. When the voltage of the super capacitor attains a lower voltage limit, the cellular modem stops receiving data from the host and sends a status code to the host and disconnects a data call and data transfer and enters into a sleep mode during which time the super capacitor is recharged. The cellular modem can reestablish the data call with the host after the super capacitor has been recharged.

Abstract: A system and method for updating industrial cellular communications devices. A supercapacitor and a cellular modem are connected electronically to one another. A host can communicate bidirectionally and wirelessly with the cellular modem. A microcontroller is connected electronically with the cellular modem, such that the microcontroller facilitates monitoring with the cellular modem of a voltage and temperature associated with the super capacitor. When the voltage of the super capacitor attains a lower voltage limit, the cellular modem stops receiving data from the host and sends a status code to the host and disconnects a data call and data transfer and enters into a sleep mode during which time the super capacitor is recharged. The cellular modem can reestablish the data call with the host after the super capacitor has been recharged.

Abstract: A power conditioning circuit includes at least one power storage device having electrodes coupled for receiving power from a DC power source. At least one active current limit (ACL) circuit coupled to the electrodes of the power storage device is for limiting a maximum power output from the power storage device under fault conditions. A DC-to-DC converter has its inputs coupled to the ACL circuit. At least one crowbar circuit has a first terminal and a second terminal and a shorting device coupled to an output of the DC-to-DC converter for providing output terminals for the power conditioning circuit.

Abstract: An interface device for providing Intrinsic Safety to a Smart Identity Module (SIM) card includes a buffer circuit including a voltage regulator and a voltage level translator including drivers. Baseband processor side pins include at least an input/output (IO) pin for receiving data signals, first SIM reset (RST) pin, core power supply (VCC) pin, a clock (CLK) pin, a battery power supply (VBAT) pin, and SIM side pins include at least a VCC pin, a SIM CLK pin, second SIM RST pin, and a SIM IO pin. There is at least one series resistor (R1, R2, R3, R4 and R5) in series with each of the baseband processor side pins.

Abstract: A packaged cellular modem system includes a capacitor for receiving power from a DC power source, a DC-to-DC converter coupled to capacitor electrodes, a cellular modem coupled to the converter output and to an antenna, and an IS barrier circuit coupled to a modem output. A microcontroller coupled to a boost regulator has its output coupled to electrodes. A metrology jumper is between the microcontroller and ground. An encapsulation material provides a potted area for the capacitor, converter, modem, IS barrier circuit and microcontroller. A SIM card is coupled to the modem by the IS barrier circuit. LED's are coupled to the microcontroller. The SIM card and LEDs are in a non-potted area. A transparent SIM card access cover over the SIM card and LEDs enables exposing the SIM card.

Abstract: A ferrule for an implantable medical device (IMD) can employ stamped metal portion including an electrically-conductive ferrule portion. The stamped ferrule portion can be affixed to a wall of a housing of the IMD. The resulting ferrule can provide cost savings or higher production throughput over a ferrule employing machined ferrule portion.

Abstract: A ferrule for an implantable medical device (IMD) can employ stamped metal portion including an electrically-conductive ferrule portion. The stamped ferrule portion can be affixed to a wall of a housing of the IMD. The resulting ferrule can provide cost savings or higher production throughput over a ferrule employing machined ferrule portion.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: A terminal pin includes a substantially elongate pin body having a longitudinal axis and a terminal head, the terminal head having an opening for receiving a wire, the opening extending substantially transverse to the longitudinal axis. This results in a substantial reduction in space required as compared to other connection structures.

Abstract: A terminal pin includes a substantially elongate pin body having a longitudinal axis and a terminal head, the terminal head having an opening for receiving a wire, the opening extending substantially transverse to the longitudinal axis. This results in a substantial reduction in space required as compared to other connection structures.

Abstract: A terminal pin includes a substantially elongate pin body having a longitudinal axis and a terminal head, the terminal head having an opening for receiving a wire, the opening extending substantially transverse to the longitudinal axis. This results in a substantial reduction in space required as compared to other connection structures.

Abstract: A terminal pin includes a substantially elongate pin body having a longitudinal axis and a terminal head, the terminal head having an opening for receiving a wire, the opening extending substantially transverse to the longitudinal axis. This results in a substantial reduction in space required as compared to other connection structures.

Abstract: A process is provided for the production of a very low melt viscosity (high melt flow index) polymer resin, suitable for use in spunbond or meltblown processing. According to the process of the current invention, a high melt viscosity (low melt flow index) resin is subjected to post-reactor molecular weight alteration by extrusion with a chemical prodegradant. The process produces a very low melt viscosity resin that can be used in spunbond or meltblown processing without further treatment to reduce the average molecular weight of the resin. Further, the very low melt viscosity resins produced according to the process of the current invention contain very little or no residual prodegradant.

Abstract: A process is provided for the production of a very low melt viscosity (high melt flow index) polymer resin, suitable for use in spunbond or meltblown processing. According to the process of the current invention, a high melt viscosity (low melt flow index) resin is subjected to post-reactor molecular weight alteration by extrusion with a chemical prodegradant. The process produces a very low melt viscosity resin that can be used in spunbond or meltblown processing without further treatment to reduce the average molecular weight of the resin. Further, the very low melt viscosity resins produced according to the process of the current invention contain very little or no residual prodegradant.