Patents by Inventor John Borland

John Borland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220371223
    Abstract: The present invention relates to devices for cutting tile and scoring concrete masonry units. These devices may function without generating large amounts of dust, while still allowing high-throughput cutting and scoring. The present invention features devices for cutting tile that may allow for multiple tiles to be cut simultaneously, thus boosting efficiency. The present invention features devices for scoring concrete masonry units that may enable precision scoring of multiple faces of the CMU. After the CMU is scored by the device of the present invention, it may be easily split along the scoring plane by hitting the top of the CMU with a hammer.
    Type: Application
    Filed: May 24, 2022
    Publication date: November 24, 2022
    Inventors: Mitchell Fairweather, John Borland
  • Patent number: 9211660
    Abstract: An adjustable support is used to support a preformed mold in a molding operation. The adjustable support includes an aggregate or particulate material that in a now stressed or reduced stress state is flowable to allow shaping thereof to effectively support a back face of the preformed mold. The adjustable support is then jammed to rigidify or fix the shape thereby effectively supporting the preformed mold. The adjustable support is changed from an adjustable state to a support state preferably by applying a vacuum pressure to the aggregate material. In the adjustable state an airflow can be introduced to the aggregate material to allow movement and/or displacement of the material.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 15, 2015
    Inventor: John Borland
  • Publication number: 20140178520
    Abstract: An adjustable support is used to support a preformed mold in a molding operation. The adjustable support includes an aggregate or particulate material that in a now stressed or reduced stress state is flowable to allow shaping thereof to effectively support a back face of the preformed mold. The adjustable support is then jammed to rigidify or fix the shape thereby effectively supporting the preformed mold. The adjustable support is changed from an adjustable state to a support state preferably by applying a vacuum pressure to the aggregate material. In the adjustable state an airflow can be introduced to the aggregate material to allow movement and/or displacement of the material.
    Type: Application
    Filed: March 14, 2013
    Publication date: June 26, 2014
    Inventor: John BORLAND
  • Patent number: 7902299
    Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: March 8, 2011
    Assignee: The Regents of the University of California
    Inventors: John Borland Kerr, Shanger Wang, Jun Hou, Steven Edward Sloop, Yong Bong Han, Gao Liu
  • Publication number: 20070210218
    Abstract: A device for holding a mouth of a plastic bag in an open position is molded of a plastic material that includes a finger hole and locking slot for retaining the bag within the device. The locking slot includes a directing member for maintaining a free end of a bag tail in the locking slot. This arrangement preferably is molded as a one piece product and has been found to be adaptable to bags of different capacities and materials. In a preferred embodiment, two finger holes are provided with each finger hole having a locking slot and directing member.
    Type: Application
    Filed: February 23, 2007
    Publication date: September 13, 2007
    Inventor: John Borland
  • Publication number: 20060292762
    Abstract: A self-aligned MISFET transistor (500H) on a silicon substrate (502), but having a graded SiGe channel or a Ge channel. The channel (526) is formed using gas-cluster ion beam (524) irradiation and provides higher channel mobility than conventional silicon channel MISFETs. A manufacturing method for such a transistor is based on a replacement gate process flow augmented with a gas-cluster ion beam processing step or steps to form the SiGe or Ge channel. The channel may also be doped by gas-cluster ion beam processing either as an auxiliary step or simultaneously with formation of the increased mobility channel.
    Type: Application
    Filed: June 21, 2006
    Publication date: December 28, 2006
    Applicant: Epion Corporation
    Inventors: John Borland, Wesley Skinner
  • Patent number: 7101643
    Abstract: New polymer electrolytes were prepared by in situ cross-linking of allyl functional polymers based on hydrosilation reaction using a multifunctional silane cross-linker and an organoplatinum catalyst. The new cross-linked electrolytes are insoluble in organic solvent and show much better mechanical strength. In addition, the processability of the polymer electrolyte is maintained since the casting is finished well before the gel formation.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: September 5, 2006
    Assignee: The Regents of the University of California
    Inventors: John Borland Kerr, Shanger Wang, Jun Hou, Steven Edward Sloop, Yong Bong Han, Gao Liu
  • Publication number: 20050277246
    Abstract: Method of forming one or more doped regions in a semiconductor substrate and semiconductor junctions formed thereby, using gas cluster ion beams.
    Type: Application
    Filed: June 11, 2005
    Publication date: December 15, 2005
    Applicant: Epion Corporation
    Inventors: Allen Kirkpatrick, Sean Kirkpatrick, Martin Tabat, Thomas Tetreault, John Borland, John Hautala, Wesley Skinner
  • Patent number: 6956083
    Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: October 18, 2005
    Assignee: The Regents of the University of California
    Inventors: John Borland Kerr, Shanger Wang, Yong Bong Han, Gao Liu, Jun Hou, Steven Edward Sloop
  • Publication number: 20050202657
    Abstract: Method of forming one or more doped regions in a semiconductor substrate and semiconductor junctions formed thereby, using gas cluster ion beams.
    Type: Application
    Filed: March 11, 2005
    Publication date: September 15, 2005
    Applicant: Epion Corporation
    Inventors: John Borland, John Hautala, Wesley Skinner
  • Publication number: 20050181621
    Abstract: Methods and apparatus are described for irradiating one or more substrate surfaces with accelerated gas clusters including strain-inducing atoms for blanket and/or localized introduction of such atoms into semiconductor substrates, with additional, optional introduction of dopant atoms and/or C. Processes for forming semiconductor films infused into and/or deposited onto the surfaces of semiconductor and/or dielectric substrates are also described. Such films may be doped and/or strained as well.
    Type: Application
    Filed: February 14, 2005
    Publication date: August 18, 2005
    Applicant: Epion Corporation
    Inventors: John Borland, John Hautala, Wesley Skinner, Martin Tabat
  • Publication number: 20030096490
    Abstract: A method for forming a shallow junction in a semiconductor wafer may include amorphizing the wafer to obtain a depth of end-of-range (EOR) defects that is smaller than a desired junction depth in a range of about 13 nm to about 50 nm, implanting a dopant material into the wafer at a selected dose and energy to produce the desired junction depth, and activating the dopant material by thermal processing of the semiconductor wafer at a selected temperature for a selected time consistent with low-temperature solid phase epitaxy (SPE) annealing to form the shallow junction. The control of the EOR depth through a preamorphizing implant to less than the junction depth provides for a low leakage junction and the low-temperature SPE anneal prevents diffusion of the dopant beyond the desired junction depth.
    Type: Application
    Filed: May 29, 2002
    Publication date: May 22, 2003
    Inventors: John Borland, Susan Felch, Ziwei Fang, Bon-Woong Koo
  • Publication number: 20030059682
    Abstract: New polymer electrolytes were prepared by in situ cross-linking of allyl functional polymers based on hydrosilation reaction using a multifunctional silane cross-linker and an organoplatinum catalyst. The new cross-linked electrolytes are insoluble in organic solvent and show much better mechanical strength. In addition, the processability of the polymer electrolyte is maintained since the casting is finished well before the gel formation.
    Type: Application
    Filed: May 31, 2002
    Publication date: March 27, 2003
    Inventors: John Borland Kerr, Shanger Wang, Jun Hou, Steven Edward Sloop, Yong Bong Han, Gao Liu
  • Publication number: 20030023001
    Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.
    Type: Application
    Filed: May 31, 2002
    Publication date: January 30, 2003
    Inventors: John Borland Kerr, Shanger Wang, Yong Bong Han, Gao Liu, Jun Hou, Steven Edward Sloop
  • Patent number: 5156338
    Abstract: A spray shield for a field sprayer includes a front skirt and a rear skirt each extending along a plurality of nozzles of the field sprayer. For each nozzle there is provided a dome-shaped enclosure which is attached to the front and rear skirt and extends therefrom upwardly toward the nozzle so that between each enclosure and the next there is defined a V-shaped through which prevailing winds can pass. The dome enclosure terminates at an edge surrounding an opening with the edge lying in a plane below the height of the top of the nozzle so that an initial portion of the spray pattern is exposed to view above the dome enclosure while an open portion of the spray pattern is protected by the dome enclosure and by the skirts from the prevailing winds.
    Type: Grant
    Filed: December 7, 1990
    Date of Patent: October 20, 1992
    Inventors: John Borland, Thomas E. Northam
  • Patent number: 5117775
    Abstract: A floation device includes a molded outer shell defining a hollow interior. The hollow interior is filled with recycled plastic bottles of the type used conventionally for soft drink containers which are molded from a plastic material and include a generally cylindrical body and a neck at one end of the body which is closed by a cap. The outer container is shaped with wall portions having a curvature equal to the outside curvature of the bottles and indentations for receiving the necks of the bottles which are aligned neck to neck in rows. The recycled bottles provide a filling for the rotational molded shell which prevent loss of buoyancy if the shell is perforated and prevent expansion and contraction problems due to temperature changes.
    Type: Grant
    Filed: November 2, 1990
    Date of Patent: June 2, 1992
    Inventors: T. Edward Northam, John Borland
  • Patent number: 4975385
    Abstract: An improved method is disclosed for forming one or more N- LDD regions in an integrated circuit structure wherein there is no offset between the gate electrode and the source and drain regions in the resulting structure which comprises the steps of: forming a polysilicon gate electrode over a semiconductor wafer substrate, N- doping the substrate to form one or more N- LDD regions, selectively depositing polysilicon on the polysilicon sidewalls of the gate electrode, and then N+ doping the substrate to form N+ source and drain regions in the substrate using the selectively deposited polysilicon as a mask over the N- LDD regions previously formed in the substrate.
    Type: Grant
    Filed: April 6, 1990
    Date of Patent: December 4, 1990
    Assignee: Applied Materials, Inc.
    Inventors: Israel Beinglass, John Borland