Patents by Inventor John Boyd

John Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12129163
    Abstract: A beverage dispenser maintains a profile queue with profile data of “close” consumer mobile computing devices. Each profile in the profile queue maintains one or more beverages previously selected by a consumer, such as favorite beverage(s), mixed or blended beverages, and/or past or future beverage order(s). Each profile in the profile queue is additionally associated with a profile identifier, such as a name, screen name, social media picture, avatar, alphanumeric identifier, other such text or graphics recognizable by a consumer to be associated with their corresponding profile. Upon navigation to an appropriate screen on the beverage dispenser, a display on the beverage dispenser shows the profile identifiers or one or more of the previously selected beverages in the profiles of “close” consumer mobile computing devices. In this way, a consumer is able to quickly access their previously selected beverages without actively manipulating their mobile device.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: October 29, 2024
    Assignee: THE COCA-COLA COMPANY
    Inventors: Scott Cuppari, Damian James Reec Mycroft, Arthur G. Rudick, Rabab Saqib Karori, Keith A. Gibson, Akhil Karibandi, John Boyd, David Mulcahey, Azam Khan, Mira Uchil
  • Patent number: 12049399
    Abstract: A beverage dispenser and method for operating a beverage dispenser may include receiving a handshake request from a mobile device of a user. A communications link may be established with the mobile device. Responsive to receiving control data associated with a beverage order from the mobile device, a physical function may be caused to be performed by the beverage dispenser.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: July 30, 2024
    Assignee: The Coca-Cola Company
    Inventors: Arthur G. Rudick, Rabab Saqib Karori, John Boyd, Keith A. Gibson, Damian J. Mycroft, Scott Cuppari, David Mulcahey
  • Publication number: 20220234880
    Abstract: A beverage dispenser and method for operating a beverage dispenser may include receiving a handshake request from a mobile device of a user. A communications link may be established with the mobile device. Responsive to receiving control data associated with a beverage order from the mobile device, a physical function may be caused to be performed by the beverage dispenser.
    Type: Application
    Filed: April 13, 2022
    Publication date: July 28, 2022
    Inventors: Arthur G. Rudick, Rahab Saqib Karori, John Boyd, Keith A. Gibson, Damian J. Mycroft, Scott Cuppari, David Mulcahey
  • Patent number: 11312610
    Abstract: A beverage dispenser and method for operating a beverage dispenser may include receiving a handshake request from a mobile device of a user. A communications link may be established with the mobile device. Responsive to receiving control data associated with a beverage order from the mobile device, a physical function may be caused to be performed by the beverage dispenser.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: April 26, 2022
    Assignee: The Coca-Cola Company
    Inventors: Arthur G. Rudick, Rabab Saqib Karori, John Boyd, Keith A. Gibson, Damian J. Mycroft, Scott Cuppari, David Mulcahey
  • Publication number: 20220073335
    Abstract: A beverage dispenser maintains a profile queue with profile data of “close” consumer mobile computing devices. Each profile in the profile queue maintains one or more beverages previously selected by a consumer, such as favorite beverage(s), mixed or blended beverages, and/or past or future beverage order(s). Each profile in the profile queue is additionally associated with a profile identifier, such as a name, screen name, social media picture, avatar, alphanumeric identifier, other such text or graphics recognizable by a consumer to be associated with their corresponding profile. Upon navigation to an appropriate screen on the beverage dispenser, a display on the beverage dispenser shows the profile identifiers or one or more of the previously selected beverages in the profiles of “close” consumer mobile computing devices. In this way, a consumer is able to quickly access their previously selected beverages without actively manipulating their mobile device.
    Type: Application
    Filed: December 20, 2019
    Publication date: March 10, 2022
    Inventors: Scott CUPPARI, Damian James Reec MYCROFT, Arthur G. RUDICK, Rabab Saqib KARORI, Keith A. GIBSON, Akhil KARIBANDI, John BOYD, David MULCAHEY, Azam KHAN, Mira UCHIL
  • Patent number: 10930107
    Abstract: A system and method of vending product items may include storing product items within a product storage area. A product item may be released from the product storage area. The product item may be hoisted over at least a portion of the product storage area. The hoisted product item may be presented to a user. In one embodiment, the product storage area may be positioned within a vending machine, and the vending machine may be mobile. The vending machine may also be self-propelled. In an embodiment, the vending machine may be moved via a controller being used by an operator. Alternatively, the vending machine may be moved autonomously.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: February 23, 2021
    Assignee: The Coca-Cola Company
    Inventors: Clayton Burnett, Lee Alan Hawkins, John Boyd, Thomas G. North, III, Chih-Shang Fu
  • Publication number: 20200031656
    Abstract: A beverage dispenser and method for operating a beverage dispenser may include receiving a handshake request from a mobile device of a user. A communications link may be established with the mobile device. Responsive to receiving control data associated with a beverage order from the mobile device, a physical function may be caused to be performed by the beverage dispenser.
    Type: Application
    Filed: July 30, 2019
    Publication date: January 30, 2020
    Inventors: Art Rudick, Rahab Itarsiwala, John Boyd, Keith Gibson, Damien Mycroft, Scott Cuppari, David Mulcahey
  • Publication number: 20190172295
    Abstract: A system and method of vending product items may include storing product items within a product storage area. A product item may be released from the product storage area. The product item may be hoisted over at least a portion of the product storage area. The hoisted product item may be presented to a user. In one embodiment, the product storage area may be positioned within a vending machine, and the vending machine may be mobile. The vending machine may also be self-propelled. In an embodiment, the vending machine may be moved via a controller being used by an operator. Alternatively, the vending machine may be moved autonomously.
    Type: Application
    Filed: May 2, 2017
    Publication date: June 6, 2019
    Inventors: Clayton Burnett, Lee Alan Hawkins, John Boyd, Thomas G. North, Chih-Shang Fu
  • Patent number: 9953314
    Abstract: A system, method, and computer-readable storage medium for enabling an individual to use a purchase-proxy mechanism to conduct a financial transaction from a computing device with an online merchant, whereby the individual is enabled to use stored personal data, such as financial account information and fulfillment information, without having to store the personal data with the online merchant. The system, method, and computer-readable storage medium furthermore enable an individual to change a payment and/or fulfillment option at the time of purchase with minimal inconvenience.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: April 24, 2018
    Assignee: SHOPSAVVY., INC.
    Inventors: Abiel Jaquez, Alexander Muse, John Boyd, Matthew Weathers, Scott Gordon Roberts, Kevin Henry Clark, Rylan Barnes
  • Patent number: 9904636
    Abstract: Modular processing units for mainframe construction built around an ultra-wide internal bus, and equipped with memory storage, an arithmetic logic unit and instruction execution unit, and a plurality of input/output ports that are designed to be directly connected with identical neighbor modular processing units, to form a mainframe computing array. In some examples, the processing units include multiple instruction units. In some further examples, the processing units include all necessary components on a single chip, in a single chip carrier package, needing only a properly specified power source.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: February 27, 2018
    Inventor: John Boyd
  • Publication number: 20170116140
    Abstract: Modular processing units for mainframe construction built around an ultra-wide internal bus, and equipped with memory storage, an arithmetic logic unit and instruction execution unit, and plurality of input/output ports that are designed to be directly connected with identical neighbor modular processing units, to form a mainframe computing array. In some examples, the processing units include multiple instruction units. In some further examples, the processing units include all necessary components on a single chip, in a single chip carrier package, needing only a properly specified power source.
    Type: Application
    Filed: October 22, 2015
    Publication date: April 27, 2017
    Inventor: John Boyd
  • Publication number: 20170073734
    Abstract: A method of diagnosing severe sepsis prior to definitive clinical diagnosis. A pattern of gene expression that correlates strongly with a future diagnosis of severe sepsis and organ failure was identified in patients who had their blood drawn at first clinical presentation. The methods comprise identifying a pattern of two or more polynucleotides, whereby the altered expression of these polynucleotides correlates with prospective and actual sepsis. Also methods of identifying agents for treating sepsis based on the characteristics of this gene expression pattern are provided.
    Type: Application
    Filed: March 13, 2015
    Publication date: March 16, 2017
    Inventors: Robert E. W. Hancock, Olga M. Pena Serrato, David G. Hancock, John Boyd
  • Patent number: 9117860
    Abstract: A cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: August 25, 2015
    Assignee: Lam Research Corporation
    Inventors: John Boyd, Yezdi Dordi, Tiruchirapalli Arunagiri, Benjamin W. Mooring, John Parks, William Thie, Fritz C. Redeker, Arthur M. Howald, Alan Schoepp, David Hemker, Carl Woods, Hyungsuk Alexander Yoon, Aleksander Owczarz
  • Publication number: 20150214093
    Abstract: A method for processing an interconnect structure on a substrate is provided, including: depositing a metallic barrier layer to line the interconnect structure, the metallic barrier layer configured to prevent diffusion of copper into the dielectric layer; depositing a thin copper seed layer over the metallic barrier layer in the interconnect structure; depositing a gap-fill copper layer over the thin copper seed layer; removing copper overburden and metallic barrier overburden, wherein removing copper overburden and metallic barrier overburden creates a planarized copper surface on the gap-fill copper layer; selectively depositing a thin layer of a cobalt-containing material on the reduced planarized copper surface; wherein the substrate is processed and transferred in controlled environments to minimize exposure to oxygen, the controlled environments defined by one or more controlled ambient environments and/or one or more vacuum environments.
    Type: Application
    Filed: March 31, 2015
    Publication date: July 30, 2015
    Inventors: Yezdi Dordi, John Boyd, Tiruchirapalli Arunagiri, Fritz C. Redeker, William Thie, Arthur M. Howald
  • Publication number: 20150132946
    Abstract: A method is provided, including the following method operations: depositing a metallic barrier layer to line a copper interconnect structure by a dry process in an integrated system configured to operate a mixture of dry and wet processes; depositing the functionalization layer over the metallic barrier layer by a wet process in the integrated system; and, depositing the copper layer over the functionalization layer in the copper interconnect structure by a wet process in the integrated system after the functionalization layer is deposited over the metallic barrier layer, wherein the material used for the functionalization layer comprises a complexing group with at least two ends, one end of the complexing group forming a bond with the metallic barrier layer and another end of the complexing group forming a bond with the copper layer.
    Type: Application
    Filed: December 2, 2014
    Publication date: May 14, 2015
    Inventors: Hyungsuk Alexander Yoon, John Boyd, Yezdi Dordi, Fritz C. Redeker
  • Publication number: 20150128861
    Abstract: An integrated system for processing a substrate to improve electromigration performance of a copper interconnect, including: a lab-ambient transfer chamber capable of transferring the substrate from a substrate cassette coupled to the lab-ambient transfer chamber into the integrated system; a vacuum transfer chamber operated under vacuum at a pressure less than 1 Torr; a vacuum process module for depositing a metallic barrier layer, wherein the vacuum process module for depositing the metallic barrier layer is coupled to the vacuum transfer chamber, and is operated under vacuum at a pressure less than 1 Torr; a controlled-ambient transfer chamber filled with an inert gas selected from a group of inert gases; and, a deposition process module used to deposit a functionalization layer on the surface of the metallic barrier layer, wherein the deposition process module used to deposit the functionalization layer is coupled to the controlled-ambient transfer chamber.
    Type: Application
    Filed: December 2, 2014
    Publication date: May 14, 2015
    Inventors: Hyungsuk Alexander Yoon, John Boyd, Yezdi Dordi, Fritz C. Redeker
  • Patent number: 8926789
    Abstract: An apparatus generating a plasma for removing fluorinated polymer from a substrate is provided. The apparatus includes a powered electrode assembly, which includes a powered electrode, a first dielectric layer, and a first wire mesh disposed between the powered electrode and the first dielectric layer. The apparatus also includes a grounded electrode assembly disposed opposite the powered electrode assembly so as to form a cavity wherein the plasma is generated. The first wire mesh is shielded from the plasma by the first dielectric layer when the plasma is present in the cavity, which has an outlet at one end for providing the plasma to remove the fluorinated polymer.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: January 6, 2015
    Assignee: Lam Research Corporation
    Inventors: Hyungsuk Alexander Yoon, John Boyd, Andras Kuthi, Andrew D. Bailey, III
  • Patent number: 8916232
    Abstract: The embodiments fill the need of improving electromigration and reducing stress-induced voids of copper interconnect by enabling deposition of a thin and conformal barrier layer, and a copper layer in the copper interconnect. The adhesion between the barrier layer and the copper layer can be improved by making the barrier layer metal-rich prior copper deposition and by limiting the amount of oxygen the barrier layer is exposed prior to copper deposition. Alternatively, a functionalization layer can be deposited over the barrier layer to enable the copper layer being deposit in the copper interconnect with good adhesion between the barrier layer and the copper layer. An exemplary method of preparing a substrate surface of a substrate to deposit a functionalization layer over a metallic barrier layer of a copper interconnect to assist deposition of a copper layer in the copper interconnect in an integrated system in order to improve electromigration performance of the copper interconnect is provided.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: December 23, 2014
    Assignee: Lam Research Corporation
    Inventors: Hyungsuk Alexander Yoon, John Boyd, Yezdi Dordi, Fritz C. Redeker
  • Publication number: 20140322446
    Abstract: An integrated system for transferring and processing a substrate in a controlled environment to enable selective deposition of a thin layer of a cobalt-alloy material on a copper surface of a copper interconnect to improve electromigration performance of the copper interconnect, comprising: a lab-ambient transfer chamber; a substrate cleaning reactor coupled to the lab-ambient transfer chamber, wherein the substrate cleaning reactor cleans the substrate surface to remove metal-organic complex contaminants on the substrate surface; a vacuum transfer chamber; a vacuum process module for removing organic contaminants from the substrate surface; a controlled-ambient transfer chamber filled with an inert gas; and an electroless cobalt-alloy material deposition process module used to deposit the thin layer of cobalt-alloy material on the copper surface of the copper interconnect after the substrate surface has been removed of metallic contaminants and organic contaminants, and the copper surface has been removed of
    Type: Application
    Filed: July 8, 2014
    Publication date: October 30, 2014
    Inventors: Yezdi Dordi, John Boyd, Tiruchirapalli Arunagiri, Fritz C. Redeker, William Thie, Arthur M. Howald
  • Patent number: 8838685
    Abstract: Methods and systems for assisting individuals arrange meetings such as networking meetings with other individuals at a specified time (or within a specified time range) and/or at a specified place (or within a specified geographic region). More specifically, methods and systems for allowing individuals to post an invitation for a meeting on an on-line network and for allowing one or more other individuals to accept such invitation.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: September 16, 2014
    Assignee: Apple Inc.
    Inventor: John Boyd