Abstract: In one aspect the present invention provides a storage medium for data, the storage medium comprising: a) a substrate, a physical portion of which comprises at least one polyimide, and b) at least one data layer on the substrate. The substrate comprising a polyimide exhibits low axial displacement and beneficial damping characteristics.

Abstract: A method for manufacturing an embossed surface including a polymer composition having reactive moieties and a first glass transition temperature of Tg1. The method includes embossing the surface at temperature Temb; and raising the first glass transition temperature Tg1 of the embossed polymeric surface to a second glass transition temperature Tg2 such that Tg2>Temb. In another embodiment, a method for improving the release of a polymeric surface from an embossing tool includes incorporating of one or more of fluorine atoms, silicon atoms, or siloxane segments into the backbone of the polymer. The methods are particularly suited for direct patterning of photoresists, fabrication of interdigitated electrodes, and fabrication of data storage media.

Abstract: In one aspect the present invention provides a storage medium for data, the storage medium comprising: a) a substrate, a physical portion of which comprises at least one polyimide, and b) at least one data layer on the substrate. The substrate comprising a polyimide exhibits low axial displacement and beneficial damping characteristics.

Abstract: A method for manufacturing an embossed surface comprising a polymer with a first glass transition temperature Tg1 comprises embossing the surface a temperature Temb; and raising the first glass transition temperature Tg1 of the embossed polymeric surface to a second glass transition temperature Tg2 such that Tg2>Temb. In another embodiment, a method for improving the release of a polymeric surface from an embossing tool comprises incorporating of one or more of fluorine atoms, silicon atoms, or siloxane segments into the backbone of polymer. The methods are particular suited for direct patterning of photoresists, fabrication of interdigitated electrodes, and fabrication of data storage media.

Abstract: In one embodiment, a spin coating process comprises: dispensing a solution of a solution solvent and about 3 to about 30 wt % thermoplastic polymer, based upon the total weight of the solution, wherein the solution solvent has a boiling point at atmospheric pressure of about 110° C. to about 250° C., a polarity index of greater than or equal to about 4.0, a pH of about 5.5 to about 9; spinning the substrate; and removing the solution solvent to produce a coated substrate comprising a coating having less than or equal to 10 asperities over the entire surface of the coated substrate.