Abstract: The disclosure includes a heat-staking device comprising a base, an upright arm coupled to the base, and a head vertically movable along the upright arm. In some embodiments, the head includes a main head unit, a quill coupled to the main head unit, an insulating tip holder coupled to the quill and configured to removably retain a thermal-installation tip, and a handle configured to cause vertical motion of the insulating tip holder. The quill may also include a soldering iron configured to heat the thermal-installation tip. In some embodiments, the heat-staking device is configured to swap out thermal-installation tips while the thermal-installation tips are still hot.