Abstract: A method for direct-write patterning comprises providing a cantilever having a cantilever end, wherein the cantilever is a tipless cantilever; providing an ink disposed at the cantilever end; providing a substrate surface; and moving the cantilever end or moving the substrate surface so that ink is delivered from the cantilever end to the substrate surface. A method for direct writing of conductive metal or metal precursor comprises providing a tipless cantilever having a cantilever end; providing an ink disposed at the cantilever end, wherein the ink comprises one or more metals, one or more metallic nanoparticles, or one or more metal salts; providing a substrate surface; and contacting the cantilever end and the substrate surface so that ink is delivered from the cantilever end to the substrate surface.

Abstract: A new, low temperature method for directly writing conductive metal traces with micron and sub-micron sized features. In this method, a flat beam is used, such as an AFM cantilever, with or without a tip, to draw traces of metal precursor ink onto a substrate. The dimensions of the metal traces can be directly controlled by the geometry of the cantilever, so that one can controllably deposit traces from 1 micron to over 100 microns wide with microfabricated cantilevers. Cantilevers with sharp tips can be used to further shrink the minimum features sizes to sub-micron scale. The height of the features can be increased by building layers of similar or different material.

Abstract: A new, low temperature method for directly writing conductive metal traces with micron and sub-micron sized features. In this method, a flat beam is used, such as an AFM cantilever, with or without a tip, to draw traces of metal precursor ink onto a substrate. The dimensions of the metal traces can be directly controlled by the geometry of the cantilever, so that one can controllably deposit traces from 1 micron to over 100 microns wide with microfabricated cantilevers. Cantilevers with sharp tips can be used to further shrink the minimum features sizes to sub-micron scale. The height of the features can be increased by building layers of similar or different material. To obtain highly conductive and robust patterns with this deposition method, two general ink formulation strategies were designed. The key component of both ink systems is nanoparticles with diameters less than 100 nm.