Abstract: In some embodiments, nested filters can be implemented as a radio-frequency device that includes a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

Abstract: Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

Abstract: Aspects of the disclosure include a wireless device comprising one or more antennas, a first duplexer configured to receive a transmit signal and a first carrier-aggregated receive signal, a second duplexer configured to receive a second carrier-aggregated receive signal, an antenna switch module (ASM) coupled between the first duplexer and the second duplexer and the one or more antennas, one or more phase-shifting components, and at least one controller configured to selectively couple at least one phase-shifting component of the one or more phase-shifting components to the ASM based on a respective frequency of each of the transmit signal, the first carrier-aggregated receive signal, and the second carrier-aggregated receive signal.

Abstract: A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The surface mount device inductor includes an inductor coil, an anode structure disposed over a first end of the inductor coil and a cathode structure disposed over a second end of the inductor coil opposite the first end, the cathode structure being spaced apart from the anode structure. One or both of the anode structure and the cathode structure comprise a shield portion disposed at least partially over the inductor coil to thereby reduce electromagnetic coupling between adjacent surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.

Abstract: Radio frequency communication systems with a combined antenna impedance tuning and antenna multiplexing functionality are provided. In certain embodiments, a packaged radio frequency module includes an antenna multiplexer and an antenna impedance tuner. The module can be configured to provide impedance matching between one or more radio frequency front end modules and an antenna. The antenna impedance tuner can supplement antenna tuning provided by an antenna aperture separately connected to the antenna.

Abstract: A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.

Abstract: Radio frequency communication systems with a combined antenna impedance tuning and antenna multiplexing functionality are provided. In certain embodiments, a packaged radio frequency module includes an antenna multiplexer and an antenna impedance tuner. The module can be configured to provide impedance matching between one or more radio frequency front end modules and an antenna. The antenna impedance tuner can supplement antenna tuning provided by an antenna aperture separately connected to the antenna.

Abstract: Radio frequency communication systems with a combined antenna impedance tuning and antenna multiplexing functionality are provided. In certain embodiments, a packaged radio frequency module includes an antenna multiplexer and an antenna impedance tuner. The module can be configured to provide impedance matching between one or more radio frequency front end modules and an antenna. The antenna impedance tuner can supplement antenna tuning provided by an antenna aperture separately connected to the antenna.

Abstract: Radio frequency communication systems with a combined antenna impedance tuning and antenna multiplexing functionality are provided. In certain embodiments, a packaged radio frequency module includes an antenna multiplexer and an antenna impedance tuner. The module can be configured to provide impedance matching between one or more radio frequency front end modules and an antenna. The antenna impedance tuner can supplement antenna tuning provided by an antenna aperture separately connected to the antenna.

Abstract: Reconfigurable front-end module for carrier aggregation. In some embodiments, a front-end module can include a plurality of signal ports and a plurality of antenna ports. The front-end module can further include a switch assembly configured to route signals along one or more of a plurality of filtering paths between the signal ports and the antenna ports. Each of the filtering paths can include a filter, and the filtering paths can be configured to allow the antenna ports to be combined outside of the front-end module to accommodate a corresponding antenna configuration. The filtering paths can be further configured to maintain desirable filtering performance levels for different combinations of the antenna ports outside of the front-end module corresponding to the different antenna configurations.

Abstract: A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.

Abstract: Stacked wafer-level packaging devices. In some embodiments, a wireless device includes a transceiver configured to generate a radio-frequency (RF) signal. The wireless device also includes a front-end module (FEM) in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second wafer-level packaging device having an RF shield, the second wafer-level packaging device positioned over the first wafer-level packaging device such that the RF shield of the second wafer-level packaging device is electrically connected to the RF shield of the first wafer-level packaging device.

Abstract: Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

Abstract: Stacked wafer-level packaging devices. In some embodiments, a wireless device includes a transceiver configured to generate a radio-frequency (RF) signal. The wireless device also includes a front-end module (FEM) in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second wafer-level packaging device having an RF shield, the second wafer-level packaging device positioned over the first wafer-level packaging device such that the RF shield of the second wafer-level packaging device is electrically connected to the RF shield of the first wafer-level packaging device.

Abstract: Reconfigurable front-end module for carrier aggregation. In some embodiments, a front-end module can include a plurality of signal ports and a plurality of antenna ports. The front-end module can further include a switch assembly configured to route signals along one or more of a plurality of filtering paths between the signal ports and the antenna ports. Each of the filtering paths can include a filter, and the filtering paths can be configured to allow the antenna ports to be combined outside of the front-end module to accommodate a corresponding antenna configuration. The filtering paths can be further configured to maintain desirable filtering performance levels for different combinations of the antenna ports outside of the front-end module corresponding to the different antenna configurations.

Abstract: Circuits and methods related to radio-frequency (RF) power couplers. In some embodiments, an RF circuit can include a first circuit having a frequency response that includes a feature within a selected frequency range, and a second circuit coupled to the first circuit such that the feature of the frequency response is at least in part due to the coupling. The RF circuit can further include an adjustment circuit configured to move the feature away from the selected frequency range. In some embodiments, such an RF circuit can be implemented in a packaged module which in turn can be included in a wireless device.

Abstract: Stacked wafer-level packaging devices. In some embodiments, a wireless device includes a transceiver configured to generate a radio-frequency (RF) signal. The wireless device also includes a front-end module (FEM) in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second wafer-level packaging device having an RF shield, the second wafer-level packaging device positioned over the first wafer-level packaging device such that the RF shield of the second wafer-level packaging device is electrically connected to the RF shield of the first wafer-level packaging device.

Abstract: Devices and method related to stacked duplexers. In some embodiments, an assembly may include a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield. The assembly may also include a second WLP device having an RF shield, the second WLP device positioned over the first WLP device such that the RF shield of the second WLP device is electrically connected to the RF shield of the first WLP device.

Abstract: Devices and method related to stacked duplexers. In some embodiments, an assembly may include a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield. The assembly may also include a second WLP device having an RF shield, the second WLP device positioned over the first WLP device such that the RF shield of the second WLP device is electrically connected to the RF shield of the first WLP device.

Abstract: Circuits and methods related to radio-frequency (RF) power couplers. In some embodiments, an RF circuit can include a first circuit having a frequency response that includes a feature within a selected frequency range, and a second circuit coupled to the first circuit such that the feature of the frequency response is at least in part due to the coupling. The RF circuit can further include an adjustment circuit configured to move the feature away from the selected frequency range. In some embodiments, such an RF circuit can be implemented in a packaged module which in turn can be included in a wireless device.