Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: An earphone device capable of achieving sound bandwidths beyond the 150-7000 Hz wideband range, and configured for supra-concha or supra-aural placement. The earphone comprises at least two frequency range receivers positioned within a housing. In at least one embodiment, the earphone is capable of achieving a super-wideband range by physically combining a low frequency range receiver and a high frequency range receiver in a space-efficient and acoustically advantageous manner.

Abstract: The microphone system for communication devices that comprises an electric circuit comprising two microphone elements connected to a signal flow processor. This processor uses a digital signal processor or comparable analog circuitry to provide a particular electrical time delay (?) to one of the microphone elements (nearest the ear or loudspeaker) and a compatible amplitude gain (Gm1) to the other microphone element (nearest the user's mouth) in order to substantially reduce the external acoustic coupling and echo of communication devices in the receive and doubletalk state. Further, this processing system allows the microphone system to reduce the pickup of ambient noise in the send and idle state, while still being sensitive to the user's speech.

Abstract: An earphone device capable of achieving sound bandwidths beyond the 150-7000 Hz wideband range, and configured for supra-concha or supra-aural placement. The earphone comprises at least two frequency range receivers positioned within a housing. In at least one embodiment, the earphone is capable of achieving a super-wideband range by physically combining a low frequency receiver and a high frequency receiver in a space-efficient and acoustically advantageous manner.

Abstract: A microphone isolation system. The system includes an isolation member, a support member, and at least two compliant members. The at least two compliant members mechanically support the isolation member and isolate the isolation member from vibrations. The at least two compliant members can also isolate the support member from any vibratory excitation source coupled to and/or supported by the isolation member.

Abstract: A speaker mounting system wherein the speaker is mounted to a support surface indirectly by a compliant gasket with no rigid mechanical coupling between the speaker and the surface. Accordingly, mechanical transmission of vibrations from the speaker to the surface is greatly reduced. The gasket has a cross-section configured as a curved beam with one end secured to the support surface and the other end terminated by a thickened portion having an interior annular groove receiving the open end edge of the rigid outer basket of the speaker.

Abstract: The long term average broad band gains of a plurality of individual signal channels, associated with a corresponding plurality of microphone elements, are electronically and dynamically adapted to one another. This is realized by periodically and dynamically processing the signals from the individual microphone elements. More specifically, the processing is such that the long term average broad band gain of the signal channels of the individual microphone elements is dynamically adjusted, an energy estimate of each microphone signal channel is averaged over the long term and the difference in energy between the signal channels is used to readjust the long term average broad band gain of the microphone signal channels to minimize those differences.

Abstract: Full directional pickup coverage is realized by employing a pickup arrangement which provides a plurality of audio polar directivity patterns, i.e., directional beams. These polar directivity patterns are formed in a unique embodiment of the invention by generating a plurality of frequency independent time-delayed versions of a corresponding plurality of spatially sampled signals and by combining each of the plurality of spatially sampled signals with one or more selected ones of the time delayed versions to generate at least a similar plurality of polar directivity patterns. More specifically, the spatially sampled signals are combined with the delayed versions in such a manner that a greater number of polar directivity patterns can be considered than the number of spatially sampled signals. In a specific embodiment, the spatially sampled signals are acoustic (audio) and a plurality of microphones arranged in a predetermined spatial configuration is employed to obtain them.

Abstract: A directional microphone assembly is constructed from a first-order-gradient microphone element enclosed within a housing, molded from an acoustically-opaque, resilient material such as Ethylene-Propylene-Diene-Monomer. The microphone element includes a diaphragm which moves under the influence of sound pressures applied on its opposite surfaces to generate an electrical signal which is proportional to the differential sound pressure. The housing includes a first acoustically-transparent channel for communicating sound pressure from a first opening in the housing to one surface of the diaphragm, and a second acoustically-transparent channel for communicating sound pressure from a second opening in the housing to the other surface of the diaphragm. The housing supports the microphone element and forms a continuous seal around its perimeter so that sound pressure in one channel does not leak into the other.

Abstract: A loudspeaking telephone station (speakerphone) includes a loudspeaker and one or more microphones within the same housing. The microphones are directional, each having a polar response characteristic that includes a major lobe, one or more side lobes, and nulls between pairs of lobes. The loudspeaker is positioned in the null of the polar response characteristic that resides between the major lobe and an adjacent side lobe. The microphone apparatus is positioned so that its major lobe is aimed in a direction that is generally perpendicular to the direction that the loudspeaker is aimed. Means are provided for increasing the distance between input sound ports of a first-order-gradient (FOG) microphone and thereby improving its sensitivity. A pair of such improved FOG microphones are used in assembling a second-order-gradient microphone. Full duplex operation is achieved when a pair of echo cancelers are added to further reduce the coupling between the transmit and receive directions of the speakerphone.

Abstract: An electroacoustic transducer, primarily in the form of a capacitive microphone, for incorporation into a semiconductor substrate. The vibrating element comprises a largely nontensioned diaphragm, such as an epitaxial layer formed on the semiconductor substrate, so as to greatly reduce its mechanical stiffness. The substrate is etched away in the desired area to define the diaphragm and form an acoustic cavity. A continuous array of microscopic holes is formed in the backplate to cut down the lateral flow of air in the gap between capacitor electrodes. Narrow gaps made possible by the hole array allow low voltage diaphragm biasing. In at least one embodiment, the acoustic input can be provided through the air hole array. An acoustic port may be added to alter the frequency response of the device, and a back closure provided to act as a rear acoustic cavity and an EMI shield.