Patents by Inventor John C. Camp

John C. Camp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing defects in I/C card and resulting card
    Publication number: 20010041308
    Abstract: A technique is provided for forming a circuitized substrate which substantially reduces defects in a circuit board formed of multiple layers of dielectric material on each of which layers electrical circuitry is formed. Each layer of dielectric material is formed of two distinct and separate coatings or sheets or films of a photopatternable dielectric material which is photoformed to provide through openings to the layer of circuitry below and then plated with the desired circuitry including plating in the photoformed openings to form vias. In this way if there is a pin hole type defect in either coating or sheet of dielectric material, in all probability it will not align with a similar defect in the other sheet or coating of the dielectric layer, thus preventing unwanted plating extending from one layer of circuitry to the underlying layer of circuitry.
    Type: Application
    Filed: July 17, 2001
    Publication date: November 15, 2001
    Applicant: International Business Machines Corporation
    Inventors: Ashwinkumar C. Bhatt, John C. Camp, Mary Beth Fletcher, Kenneth Lynn Potter, John A. Welsh
  • Method of reducing defects in I/C card and resulting card
    Patent number: 6274291
    Abstract: A technique is provided for forming a circuitized substrate which substantially reduces defects in a circuit board formed of multiple layers of dielectric material on each of which layers electrical circuitry is formed. Each layer of dielectric material is formed of two distinct and separate coatings or sheets or films of a photopatternable dielectric material which is photoformed to provide through openings to the layer of circuitry below and then plated with the desired circuitry including plating in the photoformed openings to form vias. In this way if there is a pin hole type defect in either coating or sheet of dielectric material, in all probability it will not align with a similar defect in the other sheet or coating of the dielectric layer, thus preventing unwanted plating extending from one layer of circuitry to the underlying layer of circuitry.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: August 14, 2001
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar C. Bhatt, John C. Camp, Mary Beth Fletcher, Kenneth Lynn Potter, John A. Welsh