Patents by Inventor John C. Chai

John C. Chai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12150277
    Abstract: A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: November 19, 2024
    Assignee: Shenzhen Envicool Technology Co., Ltd.
    Inventors: Viacheslav Stetsyuk, Ye Wang, John C. Chai, Lichuan Wei
  • Publication number: 20230156962
    Abstract: A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.
    Type: Application
    Filed: November 11, 2022
    Publication date: May 18, 2023
    Applicant: Shenzhen Envicool Technology Co., Ltd.
    Inventors: Viacheslav STETSYUK, Ye WANG, John C. Chai, Lichuan WEI