Abstract: Disclosed is a cooling device including a tank, a foaming device and a circulating device. A cooling cavity is formed in the tank. Cooling liquid is contained in the cooling cavity to cool a heat generating object. A part of the structure of the foaming device is immersed in the cooling liquid and can generate bubbles. The bubbles can rise in the cooling liquid until closely fitting the surface to be cooled of the heat generating object. The circulating device is connected to the tank and configured to collect and condense vaporized cooling liquid and then redeliver into the cooling cavity. By arranging the foaming device, the bubble group is generated to flush the surface of the heat generating element, so as to substitute the vaporization nucleation, evaporation of liquid near the heat generating element is accelerated.

Abstract: A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.

Abstract: A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.