Patents by Inventor John C. Conner

John C. Conner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7818878
    Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: October 26, 2010
    Assignee: INTEL Corporation
    Inventors: Robert M. Nickerson, Ronald L. Spreitzer, John C. Conner, Brian Taggart
  • Publication number: 20080148559
    Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
    Type: Application
    Filed: March 4, 2008
    Publication date: June 26, 2008
    Inventors: Robert M. NICKERSON, Ronald L. SPREITZER, John C. CONNER, Brian TAGGART
  • Patent number: 7358444
    Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: April 15, 2008
    Assignee: Intel Corporation
    Inventors: Robert M. Nickerson, Ronald L. Spreitzer, John C. Conner, Brian Taggart