Patents by Inventor John C. Desko, Jr.

John C. Desko, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallization performance in electronic devices
    Patent number: 7339274
    Abstract: Phenomena such as electromigration and stress-induced migration occurring in metal interconnects of devices such as integrated circuits are inhibited by use of underlying non-planarities. Thus the material underlying the interconnect is formed to have non-planarities typically of at least 0.02 ?m in height and advantageously within 100 ?m of another such non-planarity. Such non-planarities, it is contemplated, reduce grain boundary movement in the overlying interconnect with a concomitant reduction in void aggregation.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: March 4, 2008
    Assignee: Agere Systems Inc.
    Inventors: John C. Desko, Jr., Bailey R. Jones, Sean Lian, Simon John Molloy, Vivian Ryan