Abstract: An electrical control device having a joystick operator normally biased to a central position by resiliently biased rigid strips secured to a base plate. The joystick operator is pivoted in anyone of a plurality of directions through a 360.degree. arc. No more than two electrical switches or actuatable devices can be operated simultaneously by the joystick operator. The rigid strips are resiliently biased by either the internal springs of the actuator elements of respective switches or by springs externally of the switches. Movement of the strip causes depression of the associated switch actuator element. When the joystick operator is released, its shaft is returned to an equilibrium position.

Abstract: A wire clamp for a wire bonding machine, wherein the wire clamp includes a pair of relatively shiftable wire-clamping jaws, one of the jaws having a magnet thereon which is normally attracted to a stop and engages the stop when the jaws are open. A coil adjacent to and spaced from the magnet moves the magnet away from the stop to close the jaws when the coil is energized.

Abstract: A mechanism having first means for moving a tool or the like in an up and down direction and second means for moving such device in a fore and aft direction. The mechanism is suitable for a number of different uses and is especially adapted for die bonding operations wherein a die is picked up at one location and transferred to a second location. The mechanism also has means for imparting reciprocatory motion to the device so that, if the device is a die placement tool, the tool can be utilized to provide a scrubbing action for the die on a substrate therebelow.

Abstract: A mechanism having first means for moving a tool or the like in an up and down direction and second means for moving such device in a fore and aft direction. The mechanism is suitable for a number of different uses and is especially adapted for die bonding operations wherein a die is picked up at one location and transferred to a second location. The mechanism also has means for imparting reciprocatory motion to the device so that, if the device is a die placement tool, the tool can be utilized to provide a scrubbing action for the die on a substrate therebelow.

Abstract: A tool for transfering a semiconductor die from one location to the other is mounted in a holder comprised of a shaft which is normally horizontally disposed and extends forwardly from a plate which moves up and down so that the tool can be raised and lowered. The shaft also moves longitudinally through the plate so that the tool can be moved fore and aft. A first lever driven by a cam rotated by a first motor causes the plate to move downwardly and first bias means urges the plate in an upward direction. A second lever is pivoted in a vertical plane and is coupled to a rotatable member driven by a second motor. The lever shifts the shaft fore and aft, and second bias means urges the shaft toward the lever. In a second embodiment, the first lever is omitted and a handle and linkage is substituted therefor for manual up and down control of the shaft.

Abstract: Apparatus for incrementally moving a planar frame, such as a die support frame used in the manufacture of semiconductor components. The apparatus includes means for mounting a frame for movement in a vertical plane past a heater element, whereby portions of the frame can be successively heated by the heater element to permit bonding of die to leads terminating at the upper margin of the frame. The frame is incrementally moved by one or more horizontally reciprocal pawls, each pawl being receivable within an opening in the frame during a feed stroke of the pawl and being cammed out of such opening during a return stroke thereof. A first clamp releasably clamps the frame to the heater element during a die bonding operation and moves away from the heater element at the end of the return stroke and during the feed stroke.

Abstract: A wire drag unit having a pair of relatively shiftable jaws. One jaw is mounted rigidly to a support and the other jaw is pivotally secured intermediate its ends to the support. The other jaw has a wire engaging a portion at one end and is provided with an L-shaped rod at the other end, the rod extending longitudinally of the jaws and provided with an adjustable weight thereon between said one end of the other jaw and the pivot point thereof.

Abstract: Apparatus for moving a frame of the type for supporting a plurality of integrated circuit chips or die members wherein the frame on a track is moved incrementally along the same by one or both of a pair of pawls pivotally mounted below the track and normally projecting through the plane of the track and into openings in the frame. A reciprocal drive means coupled to the pawls causes the latter to reciprocate, so that the pawls, as they move in reverse, pivot downwardly in the frame and into second frame openings, whereupon the pawls are urged forwardly and they, in turn, advance the frame through a predetermined distance. If the apparatus is used as a die bonder, an improved heat shield is provided for the heater element. Also, an improved die holder is disposed adjacent to and above the heater element. If the apparatus is used as a die test unit, an improved test probe is provided wherein test leads move in engagement with terminals of a die after the die frame has been incrementally advanced.