Abstract: A flip-chip semiconductor device (70) is formed by mounting a semiconductor die (20) to a wiring substrate (30). The wiring substrate includes a hole (39). An underfill encapsulation material (52) is dispensed around an entire perimeter of the semiconductor die. The underfill encapsulation material then flows toward the center of the die, expelling any trapped air through hole (39) of the wiring substrate to avoid voiding. By providing a method which utilizes an entire perimeter dispense, manufacturing time of the underfilling step is significantly reduced. At the same time, a uniform fillet is formed and the formation of voids in the underfill encapsulation material is avoided due to the presence of hole (39) in the wiring substrate. Multiple die (100) can also be underfilled using a single dispensing operation in accordance with the invention.

Abstract: A semiconductor device (42) has a protective containment housing (44) around the edges (24) of the die (12) to protect the die. A plurality of leads (30) are TAB bonded to the die's active surface (18). The containment housing is attached around the die such that a portion of the inner sidewalls of the housing contacts the edges of the die to seal the edges. The top edge of the containment housing acts as a dam to prevent encapsulant (14') overflowing down the die edges and to the die's inactive surface (28). Various embodiments of the containment housing are possible.