Patents by Inventor John C. Getson

John C. Getson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5525564
    Abstract: A platinum catalyst which is prepared by reacting a platinum halide with an organic compound having at least one --C.tbd.C-- group in the presence or absence of a base to form a complex which promotes the addition of silicon-bonded hydrogen atoms to silicon-bonded aliphatic unsaturated hydrocarbon groups in the presence of no-clean flux.
    Type: Grant
    Filed: April 7, 1994
    Date of Patent: June 11, 1996
    Assignee: Wacker Silicones Corp.
    Inventors: Richard McAfee, James R. Adkins, John C. Getson
  • Patent number: 5328974
    Abstract: A platinum catalyst which is prepared by reacting a platinum halide with an organic compound having at least one --C.tbd.C-- group in the presence or absence of a base to form a complex which promotes the addition of silicon-bonded hydrogen atoms to silicon-bonded aliphatic unsaturated hydrocarbon groups in the presence of no-clean flux.
    Type: Grant
    Filed: May 6, 1993
    Date of Patent: July 12, 1994
    Assignee: Wacker Silicones Corporation
    Inventors: Richard McAfee, James R. Adkins, John C. Getson
  • Patent number: 4913930
    Abstract: Apparatus for applying a coating to semiconductor chips mounted within apertures in a dielectric film. The film containing the semiconductor chips and input-output connectors is fed from a reel past an applicator for applying the coating on one side of the chips. After passing through a curing chamber, the film passes about a substantially square sprocket so as to reverse the direction of travel. The sprocket is of such a dimension that the film bends on a line between each individual chip or a selected group of chips. The strip then passes by another applicator for coating the other side of the chips. After passing through the curing chamber, including a substantially square sprocket, the film is wound on a driven sprocket. The coating may be a silicone composition, an epoxy resin, or a urethane composition.
    Type: Grant
    Filed: March 31, 1989
    Date of Patent: April 3, 1990
    Assignee: Wacker Silicones Corporation
    Inventor: John C. Getson
  • Patent number: 4862827
    Abstract: Apparatus for applying a coating to semiconductor chips mounted within apertures in a dielectric film. The film containing the semiconductor chips and input-output connectors is fed from a reel past an applicator for applying the coating on one side of the chips. After passing through a curing chamber, the film passes about a substantially square sprocket so as to reverse the direction of travel. The sprocket is of such a dimension that the film bends on a line between each individual chip or a selected group of chips. The strip then passes by another applicator for coating the other side of the chips. After passing through the curing chamber, including a substantially square sprocket, the film is wound on a driven sprocket. The coating may be a silicone composition, an epoxy resin, or a urethane composition.
    Type: Grant
    Filed: June 28, 1988
    Date of Patent: September 5, 1989
    Assignee: Wacker-Chemie GmbH
    Inventor: John C. Getson
  • Patent number: 4777205
    Abstract: An electrically conductive organopolysiloxane composition containing (1) an organopolysiloxane capable of being crosslinked, (2) a crosslinking agent capable of reacting with the organopolysiloxane, (3) from 120 to 200 parts by weight of silver coated mica particles per 100 parts by weight of organopolysiloxane (1) in which the silver coated mica particles contain from 50 to 80 percent by weight of silver based on the weight of the mica and (4) sufficient carbon black to stabilize the composition.
    Type: Grant
    Filed: July 22, 1987
    Date of Patent: October 11, 1988
    Assignee: Wacker Silicones Corporation
    Inventors: Matthew A. La Scola, John C. Getson
  • Patent number: 4584336
    Abstract: This invention relates to thermally conductive one-component room temperature vulcanizable organopolysiloxane compositions containing from 30 to 95 percent by weight of filler based on the weight of the composition, of which at least 10 percent by weight of the filler is silicon nitride particles.
    Type: Grant
    Filed: October 29, 1984
    Date of Patent: April 22, 1986
    Assignee: SWS Silicones Corporation
    Inventors: Michelle Pate, John C. Getson
  • Patent number: 4544696
    Abstract: Silicone elastomers having thermally conductive properties which comprise an organopolysiloxane having Si-bonded aliphatically unsaturated groups, an organohydrogenpolysiloxane having Si-bonded hydrogen atoms, a catalyst capable of promoting the addition of Si-bonded hydrogen to Si-bonded aliphatically unsaturated groups and from about 30 to 95 percent by weight of filler, based on the weight of the composition, of which at least 10 percent by weight of the filler is silicon nitride particles.
    Type: Grant
    Filed: October 29, 1984
    Date of Patent: October 1, 1985
    Assignee: SWS Silicones Corporation
    Inventors: Marie J. Streusand, John C. Getson, Richard C. McAfee
  • Patent number: 4221693
    Abstract: A room temperature vulcanizable composition which is stable under anhydrous conditions, but when exposed to atmospheric moisture cures to an elastomeric solid comprising (1) a hydrocarbonoxy terminated linear organopolysiloxane containing at least two hydrocarbonoxy groups per molecule, (2) an organo-silicon compound or partial hydrolyzates thereof containing at least two hydrocarbonoxy groups, (3) a titanium ester or partial hydrolyzates thereof, in which the hydrocarbonoxy groups linked to the organopolysiloxane (1), organosilicon compound (2) and titanium ester (3) are the same, and (4) carbon black which has been intimately combined with or treated with a hydrophobic agent to impart hydrophobic properties thereto, in which the hydrophobic agent is inert to the hydrocarbonoxy groups linked to the organopolysiloxane (1), organosilicon compound (2) and titanium ester (3).
    Type: Grant
    Filed: March 2, 1979
    Date of Patent: September 9, 1980
    Inventors: John C. Getson, Charles G. Neuroth
  • Patent number: 4172101
    Abstract: Modified organopolysiloxane compositions containing in situ generated particulate matter and a method for preparing the same which comprises polymerizing organic monomers having aliphatic unsaturation in the presence of vinyl containing organopolysiloxanes and free radical initiators at an elevated temperature to form a composition in which one or more of the organopolysiloxane molecules have organic groups grafted thereto through a carbon-to-carbon linkage. The resultant composition may be cured to an elastomeric solid by combining the composition obtained from the polymerization with organosilicon compounds having an average of more than two hydrogen atoms per molecule and a catalyst which promotes the addition of SiH groups to vinyl groups.
    Type: Grant
    Filed: April 14, 1978
    Date of Patent: October 23, 1979
    Assignee: SWS Silicones Corporation
    Inventor: John C. Getson
  • Patent number: 4166078
    Abstract: A modified organopolysiloxane composition containing in situ generated particulate matter and a method for preparing the same which comprises reacting an organohydrogenpolysiloxane with an organic monomer in the presence of a free radical initiator at an elevated temperature. The resultant composition may be combined with vinyl containing compounds having at least two vinyl groups per molecule and a catalyst which promotes addition of SiH groups to vinyl groups to form elastomers.
    Type: Grant
    Filed: December 16, 1977
    Date of Patent: August 28, 1979
    Assignee: SWS Silicones Corporation
    Inventor: John C. Getson
  • Patent number: 4111890
    Abstract: An organopolysiloxane composition which is stable under anhydrous conditions, but when exposed to atmospheric moisture cures to an elastomeric solid comprising (1) a hydrocarbonoxy terminated linear organopolysiloxane having at least two hydrocarbonoxy groups per molecule, (2) an organosilicon compound or partial hydrolyzates thereof containing at least two hydrocarbonoxy groups and (3) a titanium ester or partial hydrolyzates thereof in which the hydrocarbonoxy groups linked to the organopolysiloxane, organosilicon compound and the titanium ester groups are the same.
    Type: Grant
    Filed: December 19, 1977
    Date of Patent: September 5, 1978
    Assignee: SWS Silicones Corporation
    Inventors: John C. Getson, Wendell L. Johnson