Abstract: A spinal implant includes an intermediate portion and a first portion extending in a transverse orientation from the intermediate portion. The first portion includes an inner surface connectable with vertebral tissue adjacent a lamina. A second portion is spaced from the first portion and extends in a transverse orientation from the intermediate portion. The second portion includes an inner surface connectable with vertebral tissue adjacent a lamina. At least one of the first portion and the second portion includes an outer surface having a mating element engageable with a mating element of a surgical instrument. Systems, surgical instruments and methods are disclosed.

Abstract: An ultrasonic instrument includes a body, an actuation assembly, a shaft assembly, and an end effector. The actuation assembly includes an activation member that is operable to move in a first direction to select a mode of operation. The shaft assembly extends distally from the body and includes an acoustic waveguide. The end effector includes an ultrasonic blade that is in acoustic communication with the acoustic waveguide. The activation member is operable to move in a second direction to activate the end effector in a mode of operation selected by movement of the activation member in the first direction.

Abstract: Systems and methods are provided to provide guidance to a user regarding management of a physiologic condition such as diabetes. The determination may be based upon a patient glucose concentration level. The glucose concentration level may be provided to a stored model to determine a state. The guidance may be determined based at least in part on the determined state.

Abstract: A vascular anastomotic coupling device includes, for each of two vessels prepared for anastomosis, an inner ring sized to slide over an outer diameter of one of the two vessels. An outer ring is configured to trap an everted portion of the one of the two vessels between itself and the inner ring. Interface features on the inner ring and outer ring are configured to trap and hold the everted portion of the one of the two vessels between them and fix a position of the inner ring and outer ring with respect to each other. A connection interface on the outer ring is configured, when mounted on the one of the two vessels, to join with the outer ring of the other of the two vessels to join the two vessels and complete anastomosis of the two vessels.

Abstract: An integrated circuit die includes a device side and a backside opposite the device side, wherein the backside includes a heat transfer enhancement configuration formed therein or a heat transfer enhancement structure formed thereon each of which enhance a heat transfer area or a boiling nucleation site density over a planar backside surface. A method of forming an integrated circuit assembly includes disposing a heat exchanger on a multi-chip package, the multi-chip package including at least one integrated circuit die including a device side and an opposite backside includes a heat transfer enhancement configuration formed therein or a heat enhancement structure formed thereon; and contacting the backside of the at least one integrated circuit die with water or other cooling fluids, such as a mixture of water and antifreeze, alcohol, inert fluorinated hydrocarbon, helium, and/or other suitable cooling fluid (either liquid or gas).

Abstract: A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.

Abstract: The present invention provides a system and method for managing in a wireless communication device the receipt of a paging signal from a wide area wireless network. The method includes detecting by the wireless communication device whether the user of the wireless communication device is available for receiving an alert regarding incoming information via the wireless communication device. When the device determines that the user is not available for receiving the alert, one or more intervals during which a paging signal is expected as being possible are ignored by the wireless communication device, such that any paging signal for the wireless communication device that is present during the one or more intervals that are being ignored by the wireless communication device are not received by the wireless communication device.

Abstract: A vehicle chassis rail includes a tubular structure and an insert, both co-extending along a centerline. The insert is disposed, at least in-part, in the tubular structure, and includes a first wall, a second wall opposed to the first wall, and a corrugated mid-wall spanning laterally between, and attached to, the first and second walls.

Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

Abstract: A vehicle chassis rail includes a tubular structure and an insert, both co-extending along a centerline. The insert is disposed, at least in-part, in the tubular structure, and includes a first wall, a second wall opposed to the first wall, and a corrugated mid-wall spanning laterally between, and attached to, the first and second walls.

Abstract: A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.

Abstract: A system includes a processor and a phased array, coupled to the processor, having an arrayed waveguide for acoustic waves to enable directional sound communication.

Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.

Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

Abstract: An electronic device (300) includes a housing (301). A touch sensitive surface (100) can be disposed along the housing. The touch sensitive surface can include a recessed surface feature (106) on a portion of the touch sensitive surface. A control circuit (315), operable with the touch sensitive surface, can detect a predetermined gesture sequence (501, 502, 503) when a touch actuation along the touch sensitive surface interacts with the recessed surface feature.

Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.

Abstract: The present invention provides a system and method for managing in a wireless communication device the receipt of a paging signal from a wide area wireless network. The method includes detecting by the wireless communication device whether the user of the wireless communication device is available for receiving an alert regarding incoming information via the wireless communication device. When the device determines that the user is not available for receiving the alert, one or more intervals during which a paging signal is expected as being possible are ignored by the wireless communication device, such that any paging signal for the wireless communication device that is present during the one or more intervals that are being ignored by the wireless communication device are not received by the wireless communication device.

Abstract: An electronic device (300) includes a housing (301). A touch sensitive surface (100) can be disposed along the housing. The touch sensitive surface can include a recessed surface feature (106) on a portion of the touch sensitive surface. A control circuit (315), operable with the touch sensitive surface, can detect a predetermined gesture sequence (501, 502, 503) when a touch actuation along the touch sensitive surface interacts with the recessed surface feature.

Abstract: An electronic device (300) includes a housing (301). A touch sensitive surface (100) can be disposed along the housing. The touch sensitive surface can include a recessed surface feature (106) on a portion of the touch sensitive surface. A control circuit (315), operable with the touch sensitive surface, can detect a predetermined gesture sequence (501, 502, 503) when a touch actuation along the touch sensitive surface interacts with the recessed surface feature.