Patents by Inventor John C. Johnson

John C. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210272038
    Abstract: A system for the dynamic analysis of unstructured data where feedback loops exist between the user and the machine resulting in improved specificity and content (accuracy and precision) with regard to the results obtained from the machine learning algorithms. A Graphic User Interface (GUI) controls the configuration and deployment of all the features of the Intelligence Augmentation System (IAS) including data capture and processing, analytics, and feedback. Results of one set of algorithms can be forwarded to subsequent tools with the system for further analysis and planning using decision algorithms. The results are configured using a GUI that can manipulate the data in dynamically, allowing immediate visualization of user queries.
    Type: Application
    Filed: May 14, 2021
    Publication date: September 2, 2021
    Inventors: Michael Kowolenko, John C. Bass, Meaghan E. Johnson, Andrew Brown, Michael S. Brown, Jesse Simpson
  • Publication number: 20200176352
    Abstract: An integrated circuit die includes a device side and a backside opposite the device side, wherein the backside includes a heat transfer enhancement configuration formed therein or a heat transfer enhancement structure formed thereon each of which enhance a heat transfer area or a boiling nucleation site density over a planar backside surface. A method of forming an integrated circuit assembly includes disposing a heat exchanger on a multi-chip package, the multi-chip package including at least one integrated circuit die including a device side and an opposite backside includes a heat transfer enhancement configuration formed therein or a heat enhancement structure formed thereon; and contacting the backside of the at least one integrated circuit die with water or other cooling fluids, such as a mixture of water and antifreeze, alcohol, inert fluorinated hydrocarbon, helium, and/or other suitable cooling fluid (either liquid or gas).
    Type: Application
    Filed: June 30, 2017
    Publication date: June 4, 2020
    Inventors: Je-Young CHANG, Chandra M. JHA, Shankar DEVASENATHIPATHY, Feras EID, John C. JOHNSON
  • Patent number: 10566263
    Abstract: A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 18, 2020
    Assignee: Intel Corporation
    Inventors: Joe Walczyk, John C. Johnson
  • Patent number: 10375670
    Abstract: The present invention provides a system and method for managing in a wireless communication device the receipt of a paging signal from a wide area wireless network. The method includes detecting by the wireless communication device whether the user of the wireless communication device is available for receiving an alert regarding incoming information via the wireless communication device. When the device determines that the user is not available for receiving the alert, one or more intervals during which a paging signal is expected as being possible are ignored by the wireless communication device, such that any paging signal for the wireless communication device that is present during the one or more intervals that are being ignored by the wireless communication device are not received by the wireless communication device.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 6, 2019
    Assignee: Motorola Mobility LLC
    Inventors: Wayne Ballantyne, John C Johnson, Phillips W Lohr
  • Patent number: 10308201
    Abstract: A vehicle chassis rail includes a tubular structure and an insert, both co-extending along a centerline. The insert is disposed, at least in-part, in the tubular structure, and includes a first wall, a second wall opposed to the first wall, and a corrugated mid-wall spanning laterally between, and attached to, the first and second walls.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: June 4, 2019
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Bradley A. Newcomb, Hamid G. Kia, John C. Johnson, Robert N. Saje
  • Patent number: 10281521
    Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: May 7, 2019
    Assignee: Intel Corporation
    Inventors: David Won-jun Song, James R. Hastings, Akhilesh P. Rallabandi, Morten S. Jensen, Christopher Wade Ackerman, Christopher R. Schroeder, Nader N. Abazarnia, John C. Johnson
  • Publication number: 20190118748
    Abstract: A vehicle chassis rail includes a tubular structure and an insert, both co-extending along a centerline. The insert is disposed, at least in-part, in the tubular structure, and includes a first wall, a second wall opposed to the first wall, and a corrugated mid-wall spanning laterally between, and attached to, the first and second walls.
    Type: Application
    Filed: October 19, 2017
    Publication date: April 25, 2019
    Inventors: Bradley A. Newcomb, Hamid G. Kia, John C. Johnson, Robert N. Saje
  • Publication number: 20190096785
    Abstract: A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 28, 2019
    Inventors: Joe Walczyk, John C. Johnson
  • Patent number: 10074357
    Abstract: A system includes a processor and a phased array, coupled to the processor, having an arrayed waveguide for acoustic waves to enable directional sound communication.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventors: Sasikanth Manipatruni, Kelin J. Kuhn, Debendra Mallik, John C. Johnson
  • Patent number: 10030916
    Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: July 24, 2018
    Assignee: Intel Corporation
    Inventors: Phi Hung Thanh, Paul J. Diglio, John C. Johnson, Jarett L. Rinaldi, Arnab Choudhury
  • Publication number: 20180156863
    Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 7, 2018
    Inventors: David Won-jun Song, James R. Hastings, Akhilesh P. Rallabandi, Morten S. Jensen, Christopher Wade Ackerman, Christopher R. Schroeder, Nader N. Abazarnia, John C. Johnson
  • Patent number: 9939958
    Abstract: An electronic device (300) includes a housing (301). A touch sensitive surface (100) can be disposed along the housing. The touch sensitive surface can include a recessed surface feature (106) on a portion of the touch sensitive surface. A control circuit (315), operable with the touch sensitive surface, can detect a predetermined gesture sequence (501, 502, 503) when a touch actuation along the touch sensitive surface interacts with the recessed surface feature.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: April 10, 2018
    Assignee: Google Technology Holdings LLC
    Inventors: Chad Austin Phipps, Jeffrey R. DeVries, John C. Johnson, Louis J. Lundell, Thomas Y. Merrell, Mitul R. Patel, Jiri Slaby
  • Patent number: 9929031
    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: March 27, 2018
    Assignee: INTEL CORPORATION
    Inventors: John C. Johnson, Eric J. Moret, Lawrence M. Palanuk, Gregory A. Stone
  • Patent number: 9869714
    Abstract: A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: January 16, 2018
    Assignee: Intel Corporation
    Inventors: John C. Johnson, James G. Maveety, Abram M. Detofsky, James E. Neeb
  • Publication number: 20170289955
    Abstract: The present invention provides a system and method for managing in a wireless communication device the receipt of a paging signal from a wide area wireless network. The method includes detecting by the wireless communication device whether the user of the wireless communication device is available for receiving an alert regarding incoming information via the wireless communication device. When the device determines that the user is not available for receiving the alert, one or more intervals during which a paging signal is expected as being possible are ignored by the wireless communication device, such that any paging signal for the wireless communication device that is present during the one or more intervals that are being ignored by the wireless communication device are not received by the wireless communication device.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 5, 2017
    Inventors: Wayne Ballantyne, John C. Johnson, Phillips W. Lohr
  • Publication number: 20170269786
    Abstract: An electronic device (300) includes a housing (301). A touch sensitive surface (100) can be disposed along the housing. The touch sensitive surface can include a recessed surface feature (106) on a portion of the touch sensitive surface. A control circuit (315), operable with the touch sensitive surface, can detect a predetermined gesture sequence (501, 502, 503) when a touch actuation along the touch sensitive surface interacts with the recessed surface feature.
    Type: Application
    Filed: June 7, 2017
    Publication date: September 21, 2017
    Inventors: Chad Austin Phipps, Jeffrey R. DeVries, John C. Johnson, Louis J. Lundell, Thomas Y. Merrell, Mitul R. Patel, Jiri Slaby
  • Patent number: 9684410
    Abstract: An electronic device (300) includes a housing (301). A touch sensitive surface (100) can be disposed along the housing. The touch sensitive surface can include a recessed surface feature (106) on a portion of the touch sensitive surface. A control circuit (315), operable with the touch sensitive surface, can detect a predetermined gesture sequence (501, 502, 503) when a touch actuation along the touch sensitive surface interacts with the recessed surface feature.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: June 20, 2017
    Assignee: Google Technology Holdings LLC
    Inventors: Chad Austin Phipps, Jeffrey R. DeVries, John C. Johnson, Louis J. Lundell, Thomas Y. Merrell, Mitul R. Patel, Jiri Slaby
  • Publication number: 20170032991
    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
    Type: Application
    Filed: October 17, 2016
    Publication date: February 2, 2017
    Inventors: John C. JOHNSON, Sandeep B. SANE, Sandeep RAZDAN, Edward R. PRACK, Leonel R. ARANA, Peter A. DAVISON, Eric J. MORET, Lawrence M. PALANUK, Gregory A. STONE
  • Publication number: 20160377658
    Abstract: Improved fluid flow is described for a temperature control actuator that is used in semiconductor device test. In one example, the apparatus includes a top plate configured to thermally connect to a semiconductor device under test, a channel plate thermally connected to the top plate and having a plurality of fluid channels to receive a thermally controlled fluid from an inlet to exchange heat with the thermally controlled fluid in the channel and to eliminate the thermally controlled fluid to an outlet, a manifold to provide the thermally controlled fluid to the inlet and to receive the thermally controlled fluid through the outlet, and a flow guide in the channel thermally connected to the top plate.
    Type: Application
    Filed: June 24, 2015
    Publication date: December 29, 2016
    Applicant: INTEL CORPORATION
    Inventors: Paul J. DIGLIO, John C. JOHNSON, Weihua TANG
  • Patent number: 9526285
    Abstract: A flexible computing fabric and a method of forming thereof. The flexible computing fabric includes an electronic substrate including one or more channels and including at least two ends. At least one computational element is mounted on the electronic substrate between the two ends and at least one functional element is mounted on the electronic substrate between the two ends. The channels form an interconnect between the elements. In addition, the electronic substrate is flexible and exhibits a flexural modulus in the range of 0.1 GPa to 30 GPa.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: December 27, 2016
    Assignee: INTEL CORPORATION
    Inventors: Aleksandar Aleksov, Ravindranath V. Mahajan, Sairam Agraharam, Ian A. Young, John C. Johnson, Debendra Mallik, John S. Guzek