Abstract: An apparatus and an electrostatic process employing the apparatus which is capable of flocking spring clips of the type used in commercial applications, such as those used in the automotive industry to attach an instrument panel to an interior support structure. The apparatus and process are capable of securely adhering the flocking fibers uniformly over the irregular surfaces of a spring clip such that the spring clip can be more readily assembled while also acting to significantly dampen the vibration between the members joined by the clip. In addition, the apparatus also provides the added feature of requiring minimal space by introducing the fibers at a single point on the perimeter of the apparatus. The fibers are guided by the perimeter of the apparatus until a sufficient electrostatic charge is imparted to attract the fibers to the spring clip.