Patents by Inventor John C. Mahon

John C. Mahon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Matching circuit for integrated circuit die
    Patent number: 11424196
    Abstract: An integrated circuit (IC) die is disclosed. The IC die can include a signal via extending through the IC die. The IC die can include a transmission line extending laterally within the IC die in a direction non-parallel to the signal via, the transmission line configured to transfer an electrical signal to the signal via. The IC die can include a matching circuit disposed between the transmission line and the signal via. The matching circuit can include inductance and capacitance matching circuitry to compensate for parasitic inductance and capacitance introduced by transition from the IC die to an underlying carrier.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: August 23, 2022
    Assignee: Analog Devices, Inc.
    Inventors: John C. Mahon, Peter J. Katzin, Song Lin
  • MATCHING CIRCUIT FOR INTEGRATED CIRCUIT DIE
    Publication number: 20190371746
    Abstract: An integrated circuit (IC) die is disclosed. The IC die can include a signal via extending through the IC die. The IC die can include a transmission line extending laterally within the IC die in a direction non-parallel to the signal via, the transmission line configured to transfer an electrical signal to the signal via. The IC die can include a matching circuit disposed between the transmission line and the signal via. The matching circuit can include inductance and capacitance matching circuitry to compensate for parasitic inductance and capacitance introduced by transition from the IC die to an underlying carrier.
    Type: Application
    Filed: February 21, 2019
    Publication date: December 5, 2019
    Inventors: John C. Mahon, Peter J. Katzin, Song Lin