Abstract: An apparatus for testing the attachment reliability of a device mounted at least by an electrically conducting joint to a surface of a circuit board is provided. The apparatus includes an environmental chamber in which the board can be placed; an actuator for applying a force to the device; an electrical monitoring unit for monitoring any events at the electrically conducting joint; and a memory unit for storing an event profile that includes information related to the events. The apparatus may further include a processing unit for characterizing the quality of the electrically conducting joint based on the stored event profile and for performing various other functions. A method for testing the attachment reliability of the device is also provided.

Abstract: An apparatus for making telecommunications cable closures under field conditions consists of a heating unit with a four-sided rectangular frame that mounts on slide bars which are fixedly mounted on a surface. The heating unit may be inserted under two opposing plastic shells to be welded. The shells are contained on mounts of a press unit, which consists of a frame with an open interior containing two vertical slide bars mounting an upper and lower support which hold the two mating shells. With the heating unit in position, the press unit brings the shells into contact with the heat unit to melt the shell flanges. Thereafter, the heating unit is withdrawn and the press forces the flanges together to effect the weld. The apparatus is especially useful in applying cable closures in undersea cable-laying because of the time it saves over earlier methods.