Patents by Inventor John C. Menk
John C. Menk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11640915Abstract: Electronic device processing systems including an equipment front end module (EFEM) with a side storage pod are described. The EFEM includes an EFEM chamber and a recirculation duct. The side storage pod is fluidly coupled to the recirculation duct. The side storage pod includes an interior chamber and a side storage container disposed within the interior chamber. The side storage container is configured to receive one or more substrates from the EFEM chamber. The electronic device processing system further includes an environmental control system. The environmental control system is configured to circulate a purge gas between the EFEM chamber and the side storage pod via the recirculation duct.Type: GrantFiled: November 22, 2021Date of Patent: May 2, 2023Assignee: Applied Materials, Inc.Inventors: Paul B. Reuter, Dean C. Hruzek, Nir Merry, John C. Menk, Douglas B. Baumgarten
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Patent number: 11610794Abstract: Electronic device processing assemblies including an equipment front end module (EFEM) with at least one side storage pod attached thereto are described. The side storage pod has a side storage container. In some embodiments, an exhaust conduit extends between the chamber and a pod plenum that can contain a chemical filter proximate thereto. A supplemental fan may draw purge gas from the pod plenum through the chemical filter and route the gas through a return duct to an upper plenum of the EFEM. Methods and side storage pods in accordance with these and other embodiments are also disclosed.Type: GrantFiled: October 17, 2019Date of Patent: March 21, 2023Assignee: Applied Materials, Inc.Inventors: Paul Reuter, Dean C. Hruzek, Nir Merry, John C. Menk, Douglas B. Baumgarten
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Publication number: 20220392789Abstract: An electronic device processing system includes a factory interface (FI), substrate carrier(s), a humidity sensor, an oxygen sensor, and an environmental control system coupled to the FI. A processor of the environmental control system is to cause inert gas to be provided to an FI chamber and inert gas exhausted from the FI chamber to be circulated back into the FI chamber. The processor is also to identify conditions to be satisfied before opening a door of the substrate carriers. The processor is to control the humidity level based on detection by the humidity sensor or the oxygen level based on detection by the oxygen sensor. If the one or more conditions are satisfied, the processor is to open the carrier door to enable passing of substrates between the FI chamber and the substrate carriers.Type: ApplicationFiled: August 19, 2022Publication date: December 8, 2022Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Patent number: 11450539Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: GrantFiled: August 24, 2018Date of Patent: September 20, 2022Assignee: Applied Materials, Inc.Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas B. Baumgarten, Nir Merry
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Publication number: 20220293444Abstract: An equipment front end module, including: an equipment front end module chamber. An upper plenum at a top of the equipment front end module and including an opening into the equipment front end module chamber. A plurality of return ducts that are coupled between a bottom of the equipment front end module chamber and the upper plenum, the plurality of return ducts providing a return gas flow path enabling recirculation of gas from the equipment front end module chamber to the upper plenum.Type: ApplicationFiled: June 1, 2022Publication date: September 15, 2022Inventors: Paul B. Reuter, Robin C. Armstrong, John C. Menk, Nir Merry
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Publication number: 20220285180Abstract: An enclosure system includes walls including sidewalls and a bottom wall. The enclosure system further includes an enclosure lid configured to removably attach to one or more of the sidewalls. The walls and the enclosure lid at least partially enclose an interior volume of the enclosure system. The enclosure system further includes an upper window disposed in the enclosure lid. The upper window is configured for orientation verification of objects disposed in the interior volume. The enclosure system further includes a radio-frequency identification (RFID) holder coupled to a rear wall. The RFID holder is configured to secure an RFID component. The enclosure system further includes shelves disposed in the interior volume. Each of the shelves is configured to support a corresponding object of the objects.Type: ApplicationFiled: March 2, 2022Publication date: September 8, 2022Inventors: John C. Menk, Rachel Sara Stolzman, Douglas R. McAllister
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Patent number: 11373891Abstract: Equipment front end module (EFEM) includes front located return ducts. The EFEM may include a front wall, a rear wall, and two side walls, the front wall including a plurality of load ports, and the rear wall configured to couple to a load lock apparatus. An EFEM chamber is formed between the front wall, the rear wall, and the two side walls. An upper plenum is positioned at a top of the EFEM and includes an opening into the EFEM chamber. Return ducts provide a return gas flow path enabling recirculation of gas from the EFEM chamber to the upper plenum. At least some of the plurality of return ducts are located between the load ports. Electronic device manufacturing assemblies and methods of operating equipment front end modules are also disclosed.Type: GrantFiled: October 22, 2019Date of Patent: June 28, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Paul B. Reuter, Robin C. Armstrong, John C. Menk, Nir Merry
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Patent number: 11282724Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.Type: GrantFiled: August 7, 2019Date of Patent: March 22, 2022Assignee: Applied Materials, Inc.Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Publication number: 20220084860Abstract: Electronic device processing systems including an equipment front end module (EFEM) with a side storage pod are described. The EFEM includes an EFEM chamber and a recirculation duct. The side storage pod is fluidly coupled to the recirculation duct. The side storage pod includes an interior chamber and a side storage container disposed within the interior chamber. The side storage container is configured to receive one or more substrates from the EFEM chamber. The electronic device processing system further includes an environmental control system. The environmental control system is configured to circulate a purge gas between the EFEM chamber and the side storage pod via the recirculation duct.Type: ApplicationFiled: November 22, 2021Publication date: March 17, 2022Inventors: Paul B. Reuter, Dean C. Hruzek, Nir Merry, John C. Menk, Douglas B. Baumgarten
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Patent number: 11189511Abstract: Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a side storage container and a container plenum. A fan draws purge gas from the equipment front end module chamber into the container plenum where the purge gas is directed into the side storage container to pass over substrates stored therein and is then exhausted back into the equipment front end module chamber. Methods and systems are also disclosed.Type: GrantFiled: October 17, 2019Date of Patent: November 30, 2021Assignee: Applied Materials, Inc.Inventors: Paul B. Reuter, Dean C. Hruzek, Nir Merry, John C. Menk, Douglas B. Baumgarten
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Publication number: 20210296149Abstract: A set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system. The set of one or more shelves includes first upper surfaces disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surfaces, second upper surfaces disposed substantially in a second plane that is above the first plane, and process kit ring alignment features configured to align a process kit ring on the carrier above the second upper surfaces.Type: ApplicationFiled: March 18, 2021Publication date: September 23, 2021Inventors: Aaron Green, Nicholas Michael Bergantz, John C. Menk
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Publication number: 20200135520Abstract: Electronic device processing assemblies including an equipment front end module (EFEM) with at least one side storage pod attached thereto are described. The side storage pod has a side storage container. In some embodiments, an exhaust conduit extends between the chamber and a pod plenum that can contain a chemical filter proximate thereto. A supplemental fan may draw purge gas from the pod plenum through the chemical filter and route the gas through a return duct to an upper plenum of the EFEM. Methods and side storage pods in accordance with these and other embodiments are also disclosed.Type: ApplicationFiled: October 17, 2019Publication date: April 30, 2020Inventors: Paul Reuter, Dean C. Hruzek, Nir Merry, John C. Menk, Douglas B. Baumgarten
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Publication number: 20200135523Abstract: Equipment front end module (EFFM) includes front located return ducts. The EFFM may include a front wall, a rear wall, and two side walls, the front wall including a plurality of load ports, and the rear wall configured to couple to a load lock apparatus. An EFFM chamber is formed between the front wall, the rear wall, and the two side walls. An upper plenum is positioned at a top of the EFFM and includes an opening into the EFFM chamber. Return ducts provide a return gas flow path enabling recirculation of gas from the EFFM chamber to the upper plenum. At least some of the plurality of return ducts are located between the load ports. Electronic device manufacturing assemblies and methods of operating equipment front end modules are also disclosed.Type: ApplicationFiled: October 22, 2019Publication date: April 30, 2020Inventors: Paul B. Reuter, Robin C. Armstrong, John C. Menk, Nir Merry
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Publication number: 20200135525Abstract: Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a side storage container and a container plenum. A fan draws purge gas from the equipment front end module chamber into the container plenum where the purge gas is directed into the side storage container to pass over substrates stored therein and is then exhausted back into the equipment front end module chamber. Methods and systems are also disclosed.Type: ApplicationFiled: October 17, 2019Publication date: April 30, 2020Inventors: Paul B. Reuter, Dean C. Hruzek, Nir Merry, John C. Menk, Douglas B. Baumgarten
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Publication number: 20190362997Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.Type: ApplicationFiled: August 7, 2019Publication date: November 28, 2019Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Patent number: 10192765Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: GrantFiled: August 11, 2014Date of Patent: January 29, 2019Assignee: Applied Materials, Inc.Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Publication number: 20180366355Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: August 24, 2018Publication date: December 20, 2018Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas B. Baumgarten, Nir Merry
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Publication number: 20150045961Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: August 11, 2014Publication date: February 12, 2015Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten