Patents by Inventor John C. Regnault

John C. Regnault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040090972
    Abstract: The 802.11b wireless LAN specification is compromised by the weaknesses of WEP. The invnetion routes wireless transmissions to the LAN via a firewall or VPN gateway and encrypts them.
    Type: Application
    Filed: September 25, 2003
    Publication date: May 13, 2004
    Inventors: Mark A Barrett, David J Armes, John C Regnault, John C Sager, Jennifer F Massicott
  • Patent number: 6081835
    Abstract: An internet server is controlled wherein the server receives a hypertext transfer protocol file request from a web browser over the internet and any identification signal included with the hypertext transfer protocol file request. The identification signal is compared with one or more predetermined identification signals and depending upon the result of the comparison a file may be transmitted from the server to the web browser.
    Type: Grant
    Filed: March 11, 1997
    Date of Patent: June 27, 2000
    Assignee: British Telecommunications public limited company
    Inventors: Stuart J. Antcliff, John C. Regnault, Laurence D. Bradley
  • Patent number: 4995546
    Abstract: A technique for assembling semiconductor devices in which semiconductor elements, especially lasers or LEDs, are mounted on a first packaging element such as a heat spreader that is mounted on a second packaging element such as a heat sink. Handling of solder preforms is avoided by coating at least one of each of the pairs of surfaces to be brought into contact with a layer of solder and heating the assembly to melt both solder layers in a single operation. In a preferred embodiment a heat spreader is coated in solder on both sides and interposed between a semiconductor element and a heat sink and the assembly is heated. Molybdenum may be used as a layer to aid wetting and adhesion and gold/tin solder may be used. Slightly different solidification temperatures and compositons for the layers may result from different take up of metallization layers from the components into the solder.
    Type: Grant
    Filed: October 18, 1989
    Date of Patent: February 26, 1991
    Assignee: BT&D Technologies Limited
    Inventor: John C. Regnault