Patents by Inventor John C. Robinson

John C. Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10054381
    Abstract: A slide assembly quick release pin and arm that secure a recoil assembly within a slide. The pin is inserted through a pair of apertures in a front portion of the slide and through a bore in the nose portion of the recoil assembly aligned between the apertures. As the pin secures the recoil assembly within the slide an arm attached to the end of the pin rests in a recess, flush to the body of the slide in a locked orientation. The pin arm is rotated from a locked orientation within the recess in the assembled configuration to an unlocked orientation out of the recess before the firearm is disassembled. Additionally, the arm acts as a handle for grasping and rotating to provide a mechanical advantage when a user is removing or inserting the pin into the apertures and bore.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: August 21, 2018
    Assignee: Heizer Defense, LLC
    Inventors: Charles K. Heizer, Thomas C. Heizer, John C. Robinson, Jacob W. Mahn
  • Patent number: 8302014
    Abstract: An application displays a user interface (UI) component. A client can apply customizations to this UI component. After the client applies customizations to the UI component, the client modifies a solution set containing solutions that modify the UI component. After the client modifies the solution set, the application displays a new version of the UI component. Modifications provided by the solutions in the solution set are applied to the new version of the UI component. In addition, the customizations remain applied to the UI component without the client manually re-applying the customizations to the UI component.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: October 30, 2012
    Assignee: Microsoft Corporation
    Inventors: Humberto Lezama Guadarrama, Andrew N. Magee, Tyler M. Peelen, James S. Head, Ronghua Jin, Rubaiyat Khan, Richard L. Dickinson, John C. Robinson, Mesganaw Anteneh, Brandon J. Simons, Nicholas J. Patrick, Vicentiu Adrian Omusoru, Ankini Shah, Atul Shenoy, Bharath Swaminathan
  • Patent number: 7804994
    Abstract: An overlay method for determining the overlay error of a device structure formed during semiconductor processing is disclosed. The overlay method includes producing calibration data that contains overlay information relating the overlay error of a first target at a first location to the overlay error of a second target at a second location for a given set of process conditions. The overlay method also includes producing production data that contains overlay information associated with a production target formed with the device structure. The overlay method further includes correcting the overlay error of the production target based on the calibration data.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: September 28, 2010
    Assignee: KLA-Tencor Technologies Corporation
    Inventors: Michael Adel, Mark Ghinovker, Elyakim Kassel, Boris Golovanevsky, John C. Robinson, Chris A. Mack, Jorge Poplawski, Pavel Izikson, Moshe Preil
  • Publication number: 20030223630
    Abstract: An overlay method for determining the overlay error of a device structure formed during semiconductor processing is disclosed. The overlay method includes producing calibration data that contains overlay information relating the overlay error of a first target at a first location to the overlay error of a second target at a second location for a given set of process conditions. The overlay method also includes producing production data that contains overlay information associated with a production target formed with the device structure. The overlay method further includes correcting the overlay error of the production target based on the calibration data.
    Type: Application
    Filed: February 13, 2003
    Publication date: December 4, 2003
    Applicant: KLA-Tencor Corporation
    Inventors: Michael Adel, Mark Ghinovker, Elyakim Kassel, Boris Golovanevsky, John C. Robinson, Chris A. Mack, Jorge Poplawski, Pavel Izikson, Moshe Preil
  • Patent number: 5786893
    Abstract: An improved Raman spectrometer is provided, having, in a preferred embodiment, a light source comprising an injection-locked laser diode array, a multipass cell to multiply the intensity of the light source, a dynamic gas sample focusing system, and an atomic vapor filter to remove the Rayleigh scattered light. The laser diode arrays are tuned to match an absorption band of the atomic vapor filter. The Raman scattered light passes virtually unattenuated through the filter to be recorded by a Fourier transform spectrometer or other spectrometer. This invention permits higher sensitivity and resolution than prior art Raman spectrometers, in particular permitting identification and measurement of Raman emissions that occur at low wave numbers. The light source of this invention can also be used in conjunction with optical notch filters and photodetectors to permit detection and measurement of preselected species in a sample.
    Type: Grant
    Filed: September 26, 1994
    Date of Patent: July 28, 1998
    Assignee: Board of Regents, The University of Texas System
    Inventors: Manfred F. Fink, John C. Robinson, Walter F. Buell
  • Patent number: 4818625
    Abstract: Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.
    Type: Grant
    Filed: March 23, 1987
    Date of Patent: April 4, 1989
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Henry W. Lavendel, John C. Robinson
  • Patent number: 4810532
    Abstract: Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.
    Type: Grant
    Filed: May 31, 1988
    Date of Patent: March 7, 1989
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Henry W. Lavendel, John C. Robinson
  • Patent number: 4806431
    Abstract: Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.
    Type: Grant
    Filed: March 23, 1987
    Date of Patent: February 21, 1989
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Henry W. Lavendel, John C. Robinson
  • Patent number: 4778726
    Abstract: Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodimemt, metal amd organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.
    Type: Grant
    Filed: May 1, 1987
    Date of Patent: October 18, 1988
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Henry W. Lavendel, John C. Robinson
  • Patent number: 4692388
    Abstract: Hydrogenated boron-silica alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.
    Type: Grant
    Filed: December 2, 1986
    Date of Patent: September 8, 1987
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Henry W. Lavendel, John C. Robinson
  • Patent number: 4689104
    Abstract: Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.
    Type: Grant
    Filed: June 24, 1985
    Date of Patent: August 25, 1987
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Henry W. Lavendel, John C. Robinson