Patents by Inventor John C. Rudin

John C. Rudin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120044129
    Abstract: A reflective colour display device comprises a plurality of capillary sub-pixels arranged side by side. Each capillary sub-pixel has a first end and a second end, and a scattering medium disposed between said ends. Each capillary sub-pixel contains a transparent coloured medium which can be reversibly changed to a medium with a different light absorption property in an optical modulation region between the first end and the scattering medium. The optical modulation region of each capillary sub-pixel has a height to width aspect ratio of at least about 3. Light incident on the scattering medium through a first sub-pixel will be scattered into at least one neighbouring sub-pixel having a coloured medium of different colour to coloured medium in the first sub-pixel.
    Type: Application
    Filed: April 30, 2009
    Publication date: February 23, 2012
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventor: John C. Rudin
  • Publication number: 20080043166
    Abstract: Various methods and apparatus relating to a multi-level layer are disclosed.
    Type: Application
    Filed: July 28, 2006
    Publication date: February 21, 2008
    Inventors: Qin Liu, Bradley D. Chung, John C. Rudin, Frank E. Glass
  • Patent number: 7042057
    Abstract: A process is described for fabricating an active addressing component such as a metal-insulator-metal (MIM) device by creating surface relief levels to form trenches, and depositing a metal in the trenches. The metal is anodized to create a non-linear dielectric. A second metal is deposited in the trenches to create an electrical with the dielectric which a contact is provided, and transferring the MIM device to a substrate by adhesive transfer.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: May 9, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jian-gang Weng, Peter Mardilovich, John C. Rudin, Adrian Geisow
  • Patent number: 6967118
    Abstract: A process is described for fabricating an active addressing component such as a metal-insulator-metal (MIM) device by creating surface relief levels to form trenches, and depositing a metal in the trenches. The metal is anodized to create a non-linear dielectric. A second metal is deposited in the trenches to create an electrical with the dielectric which a contact is provided, and transferring the MIM device to a substrate by adhesive transfer.
    Type: Grant
    Filed: March 9, 2004
    Date of Patent: November 22, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jian-gang Weng, Peter Mardilovich, John C. Rudin, Adrian Geisow