Patents by Inventor John C. Schwartz

John C. Schwartz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual serial ATA connector
    Patent number: 6702620
    Abstract: A dual serial advanced technology attachment (SATA) connector that includes a first SATA connector interface, a second SATA connector interface, and a housing. The first SATA connector interface and the second SATA connector interface may be mounted in the housing in a double stack configuration parallel to each other. The first SATA connector interface and the second SATA connector interface may also be mounted in the housing longitudinally in an end-to-end configuration. The footprints on a printed circuit board (PCB) associated with the SATA connector interfaces provide less manufacturing problems and good electrical performance. Dual SATA interfaces on a single connector save PCB space and manufacturing assembly time.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: March 9, 2004
    Assignee: Intel Corporation
    Inventors: John M. Lynch, John C. Schwartz, Robert Schum, Endre C. Veka, Thomas G. Ruttan
  • Dual serial ATA connector
    Publication number: 20030045175
    Abstract: A dual serial advanced technology attachment (SATA) connector that includes a first SATA connector interface, a second SATA connector interface, and a housing. The first SATA connector interface and the second SATA connector interface may be mounted in the housing in a double stack configuration parallel to each other. The first SATA connector interface and the second SATA connector interface may also be mounted in the housing longitudinally in an end-to-end configuration. The footprints on a printed circuit board (PCB) associated with the SATA connector interfaces provide less manufacturing problems and good electrical performance. Dual SATA interfaces on a single connector save PCB space and manufacturing assembly time.
    Type: Application
    Filed: September 5, 2001
    Publication date: March 6, 2003
    Inventors: John M. Lynch, John C. Schwartz, Robert Schum, Endre C. Veka, Thomas G. Ruttan
  • Process for preparing medium density granular sodium tripolyphosphate
    Patent number: 3932590
    Abstract: Finely divided sodium tripolyphosphate (STPP) particles are sprayed with a solution of sodium orthophosphate to prepare an agglomerated feed material which is then calcined at 300.degree. to 600.degree.C to produce granular STPP of medium range bulk density.
    Type: Grant
    Filed: April 8, 1974
    Date of Patent: January 13, 1976
    Assignee: FMC Corporation
    Inventors: Raimond Pals, Robert J. Fuchs, John C. Schwartz