Abstract: IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.

Abstract: IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.

Abstract: Attachment techniques for printed circuit boards (PCBs) are described. According to some such techniques, an array of double-contact connectors may be used to attach first and second PCBs to each other. In various embodiments, each such double-contact connector may comprise respective first and second contact elements that establish and retain physical contact with the inner surfaces of vias in the first and second PCBs. In some embodiments, at least one of the double-contact connectors may provide electrical conductivity between a trace on the first PCB and a trace on the second PCB. In various embodiments, one of the two PCBs may comprise a main PCB, and the other may comprise a patch PCB arranged to relieve routing congestion in a region of the main PCB. Other embodiments are described and claimed.