Abstract: An assembly for product support and deployment for a vending machine includes a product chute, a pusher, a pusher drive assembly, and a controller. The product chute is configured to receive a plurality of products stacked on one another. The product chute includes an exit opening through which a respective product of the plurality of products is dispensed. The pusher drive assembly is operatively connected with the pusher and is configured so as to move the pusher in at least two mutually perpendicular axes. The controller is in communication with the pusher drive assembly. The controller is configured to control operation of the pusher drive assembly such that the pusher pushes the respective product being dispensed towards the exit opening and supports or lifts the remaining products in the chute against the force of gravity prior to the respective product fully exiting the product chute through the exit opening.

Abstract: A radio frequency (RF) mixing device wherein RF core circuit elements requiring signal splitting are provided with one or more signal splitting element(s) (“balun(s)”) integrated on-chip with the core RF circuit elements. The RF mixing device comprises one or more RF circuit element(s) integrated on a common substrate with one or more balun(s), wherein the common substrate is an insulating substrate further provided with associated silicon-based CMOS circuitry formed in a thin, highly crystalline silicon layer formed on the insulating substrate. The insulating substrate is selected from transparent crystalline materials such as sapphire, spinel, etc. The common substrate is preferably ultrathin silicon-on-sapphire.

Abstract: A radio frequency (RF) mixing device wherein RF core circuit elements requiring signal splitting are provided with one or more signal splitting element(s) (“balun(s)”) integrated on-chip with the core RF circuit elements. The RF mixing device comprises one or more RF circuit element(s) integrated on a common substrate with one or more balun(s), wherein the common substrate is an insulating substrate further provided with associated silicon-based CMOS circuitry formed in a thin, highly crystalline silicon layer formed on the insulating substrate. The insulating substrate is selected from transparent crystalline materials such as sapphire, spinel, etc. The common substrate is preferably ultrathin silicon-on-sapphire.