Abstract: An assembly for product support and deployment for a vending machine includes a product chute, a pusher, a pusher drive assembly, and a controller. The product chute is configured to receive a plurality of products stacked on one another. The product chute includes an exit opening through which a respective product of the plurality of products is dispensed. The pusher drive assembly is operatively connected with the pusher and is configured so as to move the pusher in at least two mutually perpendicular axes. The controller is in communication with the pusher drive assembly. The controller is configured to control operation of the pusher drive assembly such that the pusher pushes the respective product being dispensed towards the exit opening and supports or lifts the remaining products in the chute against the force of gravity prior to the respective product fully exiting the product chute through the exit opening.

Abstract: A vending machine includes a refrigerated enclosure including a housing for storage of an associated pre-packaged food product. The housing has a sidewall with a sidewall opening. A door is mounted to the sidewall for closing and opening the sidewall opening. A drive mechanism is operably connected to the door and adapted to mechanically move the door between a closed position and an opened position. The drive mechanism includes at least one sensing device adapted to determine whether the door is in one of the closed position and the opened position. A door rail is mounted to the sidewall and has a guide track. The door is movably received in the guide track.

Abstract: A vending machine includes a refrigerated enclosure including a housing for storage of an associated pre-packaged food product. The housing has a sidewall with a sidewall opening A door is mounted to the sidewall for closing and opening the sidewall opening. A drive mechanism is operably connected to the door and adapted to mechanically mow the door between a closed position and an opened position. The drive mechanism includes at least one sensing device adapted to determine whether the door is in one of the closed position and the opened position. A door rail is mounted to the sidewall and has a guide track. The door is movably received in the guide track.

Abstract: A vending machine adapted for dispensing at least one pre-packaged food product includes a microwave oven. The microwave oven includes a magnetron that emits microwave electromagnetic radiation, a housing that defines a microwave cavity for receiving the food product. The housing defines a first opening to allow passage of the pre-packaged food product between outside of the microwave cavity and inside of the microwave cavity. The microwave oven also includes a first chain door that selectively covers the first opening so as to prevent the microwave electromagnetic radiation from escaping the housing through the first opening.

Abstract: A radio frequency (RF) mixing device wherein RF core circuit elements requiring signal splitting are provided with one or more signal splitting element(s) (“balun(s)”) integrated on-chip with the core RF circuit elements. The RF mixing device comprises one or more RF circuit element(s) integrated on a common substrate with one or more balun(s), wherein the common substrate is an insulating substrate further provided with associated silicon-based CMOS circuitry formed in a thin, highly crystalline silicon layer formed on the insulating substrate. The insulating substrate is selected from transparent crystalline materials such as sapphire, spinel, etc. The common substrate is preferably ultrathin silicon-on-sapphire.

Abstract: A radio frequency (RF) mixing device wherein RF core circuit elements requiring signal splitting are provided with one or more signal splitting element(s) (“balun(s)”) integrated on-chip with the core RF circuit elements. The RF mixing device comprises one or more RF circuit element(s) integrated on a common substrate with one or more balun(s), wherein the common substrate is an insulating substrate further provided with associated silicon-based CMOS circuitry formed in a thin, highly crystalline silicon layer formed on the insulating substrate. The insulating substrate is selected from transparent crystalline materials such as sapphire, spinel, etc. The common substrate is preferably ultrathin silicon-on-sapphire.