Patents by Inventor John C. Zyzo

John C. Zyzo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for fluxless solder bonding
    Patent number: 5205461
    Abstract: Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.
    Type: Grant
    Filed: May 16, 1990
    Date of Patent: April 27, 1993
    Assignee: International Business Machines Corporation
    Inventors: Harry R. Bickford, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, John C. Zyzo
  • Method and apparatus for fluxless solder bonding
    Patent number: 4937006
    Abstract: Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.
    Type: Grant
    Filed: July 29, 1988
    Date of Patent: June 26, 1990
    Assignee: International Business Machines Corporation
    Inventors: Harry R. Bickford, Raymond R. Horton, Ismail C. Novan, Michael J. Palmer, John C. Zyzo