Abstract: The present invention relates generally to the rotary high density heat exchangers. In one embodiment, the present invention relates to rotary high density heat exchangers that contain one or more fan blades where each fan blade contains heat exchanging surfaces on the surface thereof.

Abstract: The present invention relates generally to the rotary high density heat exchangers. In one embodiment, the present invention relates to rotary high density heat exchangers that contain one or more fan blades where each fan blade contains heat exchanging surfaces on the surface thereof.

Abstract: The present invention relates generally to the rotary high density heat exchangers. In one embodiment, the present invention relates to rotary high density heat exchangers that contain one or more fan blades where each fan blade contains heat exchanging surfaces on the surface thereof.

Abstract: The present invention is a powder aerosol device that includes a cylindrical vessel, a nozzle that disperses by aerosol a plurality of dry powders and nano-materials contained in the cylindrical vessel and a propellant chamber that contains a propellant. The device also includes a cylinder that contains the plurality of dry powders and nano-materials dispersed by the aerosol to ambient, a piston held within the cylinder that moves the piston to push the plurality of dry powders and nano-materials toward the nozzle and a plurality of apertures disposed on the piston where propellant stream is passed through the plurality of apertures which fluidizes the plurality of dry powders and nano-materials. The present invention also includes a method for aerosol dispensing of a plurality of dry powders and nano-materials with a powder aerosol device.

Abstract: A machine for passively removing heat generated by an electronic circuit board is disclosed. In a typical embodiment an electronic circuit board of any type or size is comprised of electronic components producing heat during operation. High thermal conductivity moldable pads applied to both sides of the electronic circuit board form a conductive pathway to transport heat away from electronic circuits and components. A two piece rigid heat sink having thin rigid conductive fins on its top base is coupled together forming a cavity into which the computer board/conductive pad assembly fits, thereby forming a second conductive pathway for heat transport away from board features. The thin rigid conductive fins collectively form yet a third conductive pathway for heat transport from the solid base of the two piece rigid heat sink. Exposure of the thin rigid conductive fins to cooler surrounding air provides convective transfer of heat from the fins to ambient air.

Abstract: A machine for compressing gases and vapors includes a housing base containing an internal raceway, a spinning rotor containing a plurality of hollow cylinders, a plurality of spherical balls serving as positive displacement pistons which roll atop a housing base raceway and which reciprocate within the rotor cylinders, a static center rod containing intake and exhaust ports and a plurality of magnets providing rotational torque to the rotor, which are driven by an AC or DC motor during operation. A preferred embodiment includes the step(s) of gas or vapor intake, compression and exhaust within each rotor cylinder through a cycle during which the ball pistons reciprocate into and out of each cylinder while rolling atop the housing raceway. A preferred embodiment includes compression of gas and vapor occurring quietly, efficiently, with low mechanical vibration and in any physical orientation of the machine.