Abstract: An electronic device includes a leadframe including a die pad and contacts, where a die attached is to the die pad. Wire bonds are attached from the die to the contacts and a mold compound overlies the leadframe and encapsulates the die and the wire bonds. The mold compound has angled side surfaces that extend from a top of the mold compound to a bonding surface of the contacts. The contacts extend from the angled side surfaces in a range of approximately 100 to 300 um.

Abstract: An electronic device includes a multilevel package substrate, a semiconductor die mounted to the multilevel package substrate, and a package structure that encloses the semiconductor die and a portion of the multilevel package substrate. The multilevel package substrate has a first level, a second level, a first metal stack, and a second metal stack. The first metal stack includes a first set of contiguous metal structures of the first and second levels, the second metal stack includes a second set of contiguous metal structures of the first and second levels, the first and second metal stacks are spaced apart from one another, a first metal trace of the first metal stack partially overlaps a second metal trace of the second metal stack, and the first and second metal traces are in different levels of the multilevel package substrate.

Abstract: An electronic device includes a package structure, a semiconductor die and a set of conductive leads, in which the package structure has a triangular shape with a bottom first side, a top second side and lateral third, fourth, and fifth sides. The set of conductive leads extend along the third side with one of the set of conductive leads electrically coupled to a conductive terminal of the semiconductor die, the package structure encloses a portion of the semiconductor die and portions of the set of conductive leads, and the package structure exposes further portions of the set of conductive leads along the first side and additional portions of the set of conductive leads along the third side.

Abstract: An example microelectronic device package includes: a multilayer package substrate comprising routing conductors spaced by dielectric material, the multilayer package substrate having a device side surface and an opposing board side surface, and having a recessed portion extending from the device side surface and exposing routing conductors beneath the device side surface of the multilayer package substrate; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to the routing conductors; a passive component mounted to the routing conductors exposed in the recessed portion of the multilayer package substrate; and mold compound covering the semiconductor die, the passive component, and a portion of the multilayer package substrate.

Abstract: An integrated circuit package includes a die attach pad and a plurality of conductors formed from a lead frame material. A cavity is formed in a top surface of the die attach pad. A die attach adhesive is disposed within the cavity. A top surface of the die attach adhesive is flush with the top surface of the die attach pad. A semiconductor die is mounted on the die attach pad using the die attach adhesive. The semiconductor die is electrically connected to the plurality of conductors through a set of bond wires. A bottom surface of the semiconductor die is coplanar with the top surface of the die attach pad. A molding compound covers portions of the lead frame, the semiconductor die, and the set of bond wires.