Patents by Inventor John Chamberlin
John Chamberlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230212854Abstract: Disclosed is a structural sheathing panel with an integrated drainage mechanism, comprising: a structural panel core; a plurality of rows, each row of the plurality of rows comprising raised elements deposited on an external surface of the panel and spaced from one another, each of the raised elements having an elongated, linear profile which has a longitudinal axis, wherein the longitudinal axis of at least one of the raised elements of each row is not parallel to any edge of the panel.Type: ApplicationFiled: April 28, 2021Publication date: July 6, 2023Applicant: Georgia-Pacific Gypsum LLCInventors: John CHAMBERLIN, Vincent B. THOMAS
-
Patent number: 9250192Abstract: An approach is provided in which a pH-indicating compound is incorporated in a printed circuit board. The printed circuit board includes a number of layers with the pH-sensitive indicator being incorporated in one of the layers. Conductive pathways are formed from a conductive sheet laminated onto an outer surface of the printed circuit board. The printed circuit board is exposed to a pH-activating solution. Plated-through hole defects in the printed circuit board are identified by detecting a color formation at a surface location of the printed circuit board that corresponds to the plated-through hole defect. Another approach is also provided where a pH-activating compound is incorporated in one of the layers of the printed circuit board which is then exposed to a pH-indicating solution to produce the color formation that identifies the location of the plated-through hole defect.Type: GrantFiled: November 22, 2013Date of Patent: February 2, 2016Assignee: International Business Machines CorporationInventors: Bruce John Chamberlin, Chang-Min Chu, Gao-Bin Hu, Joseph Kuczynski, Kaspar Ka Chung Tsang
-
Patent number: 9201015Abstract: An approach is provided in which a pH-indicating compound is incorporated in a printed circuit board. The printed circuit board includes a number of layers with the pH-sensitive indicator being incorporated in one of the layers. Conductive pathways are formed from a conductive sheet laminated onto an outer surface of the printed circuit board. The printed circuit board is exposed to a pH-activating solution. Plated-through hole defects in the printed circuit board are identified by detecting a color formation at a surface location of the printed circuit board that corresponds to the plated-through hole defect. Another approach is also provided where a pH-activating compound is incorporated in one of the layers of the printed circuit board which is then exposed to a pH-indicating solution to produce the color formation that identifies the location of the plated-through hole defect.Type: GrantFiled: July 14, 2011Date of Patent: December 1, 2015Assignee: International Business Machines CorporationInventors: Bruce John Chamberlin, Chang-Min Chu, Gao-Bin Hu, Joseph Kuczynski, Kaspar Ka Chung Tsang
-
Patent number: 8819931Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.Type: GrantFiled: July 15, 2008Date of Patent: September 2, 2014Assignee: International Business Machines CorporationInventors: Bruce John Chamberlin, Mitchell G. Ferrill, Roger Scott Krabbenhoft
-
Publication number: 20140076478Abstract: An approach is provided in which a pH-indicating compound is incorporated in a printed circuit board. The printed circuit board includes a number of layers with the pH-sensitive indicator being incorporated in one of the layers. Conductive pathways are formed from a conductive sheet laminated onto an outer surface of the printed circuit board. The printed circuit board is exposed to a pH-activating solution. Plated-through hole defects in the printed circuit board are identified by detecting a color formation at a surface location of the printed circuit board that corresponds to the plated-through hole defect. Another approach is also provided where a pH-activating compound is incorporated in one of the layers of the printed circuit board which is then exposed to a pH-indicating solution to produce the color formation that identifies the location of the plated-through hole defect.Type: ApplicationFiled: November 22, 2013Publication date: March 20, 2014Applicant: International Business Machines CorporationInventors: Bruce John Chamberlin, Chang-Min Chu, Gao-Bin Hu, Joseph Kuczynski, Kaspar Ka Chung Tsang
-
Publication number: 20130016465Abstract: An approach is provided in which a pH-indicating compound is incorporated in a printed circuit board. The printed circuit board includes a number of layers with the pH-sensitive indicator being incorporated in one of the layers. Conductive pathways are formed from a conductive sheet laminated onto an outer surface of the printed circuit board. The printed circuit board is exposed to a pH-activating solution. Plated-through hole defects in the printed circuit board are identified by detecting a color formation at a surface location of the printed circuit board that corresponds to the plated-through hole defect. Another approach is also provided where a pH-activating compound is incorporated in one of the layers of the printed circuit board which is then exposed to a pH-indicating solution to produce the color formation that identifies the location of the plated-through hole defect.Type: ApplicationFiled: July 14, 2011Publication date: January 17, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce John Chamberlin, Chang-Min Chu, Gao-Bin Hu, Joseph Kuczynski, Kaspar Ka Chung Tsang
-
Publication number: 20130014977Abstract: An approach is provided in detecting plated-through hole defects in printed circuit boards (PCBs). The printed circuit board is exposed to a modified-silane solution. The modified-silane solution has a luminescent moiety and the modified-silane solution binds to exposed glass within a glass fiber layer of the printed circuit board. Plated-through hole defects are identified in the printed circuit board by detecting a luminescence at a surface location of the printed circuit board. Each surface location where the luminescence is detected corresponds to one of the plated-through hole defects.Type: ApplicationFiled: July 14, 2011Publication date: January 17, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce John Chamberlin, Chang-Min Chu, Gao-Bin Hu, Joseph Kuczynski, Kaspar Ka Chung Tsang
-
Patent number: 8287614Abstract: A supplemental filter media support insert is provided for use with a filter element to reinforce the filter media against filter media deformation resulting from fluid flow induced forces. The support insert is configured for installation into an air cleaner near the filter outlet face and includes support ribs which may be generally aligned to overlay reinforcement bands provided on filter media.Type: GrantFiled: August 10, 2009Date of Patent: October 16, 2012Assignee: Mann+Hummel GmbHInventors: Grant Gillispie, John Chamberlin
-
Publication number: 20110030322Abstract: A supplemental filter media support insert is provided for use with a filter element to reinforce the filter media against filter media deformation resulting from fluid flow induced forces. The support insert is configured for installation into an air cleaner near the filter outlet face and includes support ribs which may be generally aligned to overlay reinforcement bands provided on filter media.Type: ApplicationFiled: August 10, 2009Publication date: February 10, 2011Applicant: MANN+HUMMEL GMBHInventors: Grant Gillispie, John Chamberlin
-
Patent number: 7615705Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.Type: GrantFiled: July 14, 2006Date of Patent: November 10, 2009Assignee: International Business Machines CorporationInventors: Bruce John Chamberlin, Mitchell G. Ferrill, Roger Scott Krabbenhoft
-
Publication number: 20080271314Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.Type: ApplicationFiled: July 15, 2008Publication date: November 6, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce John Chamberlin, Mitchell G. Ferrill, Roger Scott Krabbenhoft
-
Publication number: 20080014419Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.Type: ApplicationFiled: July 14, 2006Publication date: January 17, 2008Inventors: Bruce John Chamberlin, Mitchell G. Ferrill, Roger Scott Krabbenhoft
-
Patent number: 7199309Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.Type: GrantFiled: June 27, 2005Date of Patent: April 3, 2007Assignee: International Business Machines CorporationInventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
-
Patent number: 7180752Abstract: A method and structures are provided for implementing enhanced reliability for printed circuit board high power dissipation applications. An external return current member provides a return current path outside of the printed circuit board, thereby minimizing power dissipation within the printed circuit board. The external return current member can be implemented with an associated stiffener formed of electrically conductive material. Alternatively, the external return current member can be implemented with a sheet of electrically conductive material with an insulator provided between the sheet and the associated stiffener.Type: GrantFiled: May 28, 2004Date of Patent: February 20, 2007Assignee: International Business Machines CorporationInventors: Bruce John Chamberlin, Erica Elizabeth Jasper Gant, Roger Scott Krabbenhoft
-
Patent number: 6912780Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.Type: GrantFiled: June 3, 2004Date of Patent: July 5, 2005Assignee: International Business Machines CorporationInventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
-
Publication number: 20040216919Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.Type: ApplicationFiled: June 3, 2004Publication date: November 4, 2004Applicant: International Business Machines CorporationInventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
-
Patent number: 6784377Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.Type: GrantFiled: July 25, 2002Date of Patent: August 31, 2004Assignee: International Business Machines CorporationInventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
-
Publication number: 20030058098Abstract: A system and methodology for a programmable and reprogrammable locating system comprising of at least one central control unit and at least one response unit. The central control unit, for activating the response unit and for programming/reprogramming the response unit, utilizes a serial bits stream signal to communicate the programming data and activation data to the response unit. Both the central control unit and the response unit utilize the generation of a square wave for discriminating between a signal as coming from a central control unit from those signals emanating from non-central control unit sources. This signal discrimination capability and signal data carrying capability allow multiple response units to be programmed/reprogrammed to one or more central control units.Type: ApplicationFiled: September 25, 2001Publication date: March 27, 2003Inventors: John Sebanc, Robert John Chamberlin
-
Patent number: 6535120Abstract: A system and methodology for a programmable and reprogrammable locating system comprising of at least one central control unit and at least one response unit. The central control unit, for activating the response unit and for programming/reprogramming the response unit, utilizes a serial bits stream signal to communicate the programming data and activation data to the response unit. Both the central control unit and the response unit utilize the generation of a square wave for discriminating between a signal as coming from a central control unit from those signals emanating from non-central control unit sources. This signal discrimination capability and signal data carrying capability allow multiple response units to be programmed/reprogrammed to one or more central control units.Type: GrantFiled: September 25, 2001Date of Patent: March 18, 2003Assignee: John Sebanc, DDSInventors: John Sebanc, Robert John Chamberlin
-
Publication number: 20020179324Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.Type: ApplicationFiled: July 25, 2002Publication date: December 5, 2002Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack