Patents by Inventor John Chester Malinowski

John Chester Malinowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • A DUAL STACKED METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR MAKING SAME
    Publication number: 20030197215
    Abstract: A multilayer semiconductor device and method of making a dual stacked metal-insulator-metal (MIM) capacitor of a multilayer semiconductor device, which includes a bottom metal layer including a capacitor plate and a wiring level, an intermediate metal layer forming at least a capacitor plate, and a top metal layer including a capacitor plate and a wiring level, a via that electrically contacts the intermediate metal layer, and at least two electrically connected vias that contact the bottom metal layer and the top metal layer. A dielectric etchstop layer may be formed above the dual stacked MIM capacitor.
    Type: Application
    Filed: February 5, 2003
    Publication date: October 23, 2003
    Applicant: International Business Machines Corporation
    Inventors: Douglas Duane Coolbaugh, Alvin Jose Joseph, John Chester Malinowski, Vidhya Ramachandran
  • Nitride etchstop film to protect metal-insulator-metal capacitor dielectric from degradation and method for making same
    Publication number: 20030146492
    Abstract: A multilayer semiconductor device that includes a metal-insulator-metal (MIM) capacitor including a first metal plate, a dielectric layer, and a second metal plate, a nitride etchstop layer formed above the MIM capacitor, a first interlayer dielectric formed on the nitride etchstop layer, and a first via and a second via that extend through at least the first interlayer dielectric to contact the nitride etchstop layer.
    Type: Application
    Filed: November 25, 2002
    Publication date: August 7, 2003
    Applicant: International Business Machines Corporation
    Inventors: John Chester Malinowski, Matthew David Moon, Vidhya Ramachandran, Kimball M. Watson
  • Modular high frequency integrated circuit structure
    Patent number: 6413868
    Abstract: Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: July 2, 2002
    Assignee: International Business Machines Corporation
    Inventors: Thomas Adam Bartush, David Louis Harame, John Chester Malinowski, Dawn Tudryn Piciacchio, Christopher Lee Tessler, Richard Paul Volant
  • Modular high frequency integrated circuit structure
    Patent number: 6259148
    Abstract: Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: July 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Thomas Adam Bartush, David Louis Harame, John Chester Malinowski, Dawn Tudryn Piciacchio, Christopher Lee Tessler, Richard Paul Volant