Patents by Inventor John Chi Hee Kwok

John Chi Hee Kwok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080081137
    Abstract: A polymer blend composition having improved physical properties comprises (i) 70% to 95% by weight of a blend of a styrene maleic anhydride (SMA) copolymer, e.g., rubber modified styrene maleic anhydride copolymer and a styrene polymer e.g., polystyrene or high impact polystyrene (HIPS) and (ii) from 30% to 5% by weight of an acrylic copolymer, e.g., a rubber modified styrene methyl methacrylate (SMMA) copolymer which acts as a compatibilizer for the SMA copolymer, which may be a regrind, and the styrene polymer. This polymer blend composition has good impact strength and elongation properties. The weight percent ratio of the SMA copolymer to styrene polymer in component (i) may be 95:5 or 5:95 based on the total weight of component (i). The polymer blend composition may be extruded into sheet and thermoformed into an article, e.g., a container for packaged foods or may be co-extruded to produce a laminated article.
    Type: Application
    Filed: September 17, 2007
    Publication date: April 3, 2008
    Applicant: NOVA Chemicals Inc.
    Inventors: John Chi Hee Kwok, Robert D. Roberts
  • Patent number: 7294676
    Abstract: Styrenic resin composition comprising a rubber modified styrene maleic anhydride copolymer and polybutene. The resin is prepared by several methods including adding polybutene into the reactor, or adding polybutene to the syrup exiting the reactor and prior to entering the devolatilizer, or compounding polybutene into the polymer in an extruder after the polymer exits the devolatilizer. The polybutene ranges from 0.1 to 8% by weight and has a number average molecular weight from 900 to 2500. The rubber ranges from 4% to 20% by weight and has a particle size from 0.1 micron to 11 microns. The resin can be extruded into sheet and thermoformed into an article or can be coextruded to produce a laminated article, which may be a container for packaged foods that can be heated in microwave ovens and which container has improved toughness, elongation, and heat distortion resistance properties.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: November 13, 2007
    Assignee: NOVA Chemicals Inc.
    Inventors: John Chi Hee Kwok, Richard Albert Cooper, Steven Michael Krupinski
  • Publication number: 20070218228
    Abstract: Packaging material comprised of a multilayer thermoplastic film structure may be used to form packaging articles, for example, stand up pouches, laminating films, and sealing/lidding stocks. The multilayer film structure contains a first layer comprised of an improved rubber modified styrenic copolymer, i.e. rubber modified styrene methyl methacrylate, a second layer comprised of a moisture barrier material, e.g. polyethylene, and a tie layer between the first and second layers made of a material selected from the group consisting of a styrene butadiene block copolymer, an ethylene vinyl acetate resin, and a maleic hydride modified ethylene vinyl acetate. An inner layer or layers of material having oxygen barrier properties, mechanical enhancement properties, or adhesive properties and a second tie layer comprising an appropriate material may be co-extruded with the first and second layers, and the tie layers for desired properties of the packaging material.
    Type: Application
    Filed: February 28, 2007
    Publication date: September 20, 2007
    Inventors: John Chi Hee Kwok, David Biscan
  • Patent number: 7223460
    Abstract: A thermoplastic sheet that includes a continuous phase and a dispersed phase, where A) the continuous phase contains a polymer composition resulting from the polymerization of a monomer mixture containing a styrenic monomer and an alkyl (meth)acrylate monomer in the presence of the dispersed phase; and B) the dispersed phase contains one or more block copolymer selected from diblock and triblock copolymers of styrene-butadiene, styrene-butadiene-styrene, styrene-isoprene, styrene-isoprene-styrene, partially hydrogenated styrene-isoprene-styrene. The thermoplastic sheet is formed by extruding a thermoplastic composition that is cut to desired dimensions to form thermoplastic items, e.g. identification cards, credit cards, bank cards, key cards, gift cards, phone cards, playing cards, menus, and the like. Indicia and/or printing can be applied to the items to provide for commercial applications. The sheet may be opaque or may be relatively clear to transparent with a Haze value of 0.01% up to 10%.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: May 29, 2007
    Assignee: NOVA Chemicals Inc.
    Inventors: John Chi Hee Kwok, Richard Delaney, Jr., Michael W. Desmarais, Richard W. Desmarais
  • Patent number: 7135234
    Abstract: A multilayer thermoplastic extruded structure comprises at least one thermoplastic polyolefin layer; at least one thermoplastic vinyl aromatic polymer layer; and a multicomponent tie layer. The multicomponent tie layer comprises at least one thermoplastic polyolefin; at least one thermoplastic vinyl aromatic polymer; and at least one styrenic block copolymer. Preferred structures are multilayer films used for packaging or multilayer sheets for thermoformed containers.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: November 14, 2006
    Assignee: Nova Chemicals (International) S.A.
    Inventors: Karen D. Donnelly, Robert Dorville Roberts, John Chi Hee Kwok, Chris K. Hung, Trevor Dean Pacholok
  • Publication number: 20040253468
    Abstract: A multilayer thermoplastic extruded structure comprises at least one thermoplastic polyolefin layer; at least one thermoplastic vinyl aromatic polymer layer; and a multicomponent tie layer. The multicomponent tie layer comprises at least one thermoplastic polyolefin; at least one thermoplastic vinyl aromatic polymer; and at least one styrenic block copolymer. Preferred structures are multilayer films used for packaging or multilayer sheets for thermoformed containers.
    Type: Application
    Filed: May 21, 2004
    Publication date: December 16, 2004
    Inventors: Karen D. Donnelly, Robert Dorville Roberts, John Chi Hee Kwok, Chris K. Hung, Trevor Dean Pacholok